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Sputtering apparatus and sputter film deposition method

A technology of sputtering device and film-forming method, which is applied in sputtering plating, ion implantation plating, metal material coating process, etc., which can solve difficult film thickness management, difficult to control uniform film thickness, and reduce film forming speed And other issues

Inactive Publication Date: 2009-09-30
AGC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, the problem with the above-mentioned conventional film forming apparatus is that it is difficult to control the film thickness with high precision. In order to improve the film thickness accuracy, the film forming speed must be reduced accordingly, and the productivity is significantly reduced.
However, it is difficult to make the conditions related to the two cathodes the same, and as a result, it is not easy to control the uniformity of the film thickness.

Method used

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  • Sputtering apparatus and sputter film deposition method
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  • Sputtering apparatus and sputter film deposition method

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Embodiment Construction

[0089] The ideal embodiment of the sputtering device and sputtering film forming method of the present invention will be described below with reference to the accompanying drawings.

[0090] figure 1 A schematic plan view showing the configuration of a sputtering apparatus for forming an optical multilayer film according to an embodiment of the present invention is shown. figure 2 It is a perspective view of the substrate holder used in this device. figure 1 The shown sputtering device 10 is a turntable type sputtering device having the following structure, that is, in a cylindrical chamber 12 with a height of 1.5 m and a diameter of 1.5 m, there is a drum ( figure 1 not shown in figure 2 17) and the substrate holders 14 provided on the outer peripheral surface of the drum 17, each substrate holder 14 constituting a regular dodecagon with a diameter of 1 m can rotate around the central axis 16 of the drum 17 as the center of rotation and hold on.

[0091] The chamber ...

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Abstract

The sputtering device and the sputtering film-forming method of the present invention are in the turntable type sputtering device in which the substrate holder is installed in the chamber, for the application of forming a low-refractive-index film and the application of forming a high-refractive-index film, the common For magnetrons and AC magnetrons, AC magnetrons are used to form films up to 90% of the designed film thickness, and then only commonly used magnetrons are used to form films, which enables high-precision film thickness control and high productivity.

Description

[0001] This application is a divisional application of a patent application with an application date of February 6, 2002, an application number of 02804597.1, and an invention title of "sputtering device and sputtering film forming method". technical field [0002] The invention relates to a sputtering device and a sputtering film-forming method suitable for film-forming processes such as optical filters, and in particular to a sputtering device suitable for manufacturing WDM filters used in WDM (Wavelength Division Multiplexing, wavelength division multiplexing) technology. Sputtering device and sputtering film forming method. Background technique [0003] Japanese Patent Application Laid-Open No. 3-253568 discloses a rotary disk sputtering apparatus for forming a film on a substrate such as a glass plate. The turntable type sputtering device is a rotary intermittent type sputtering device, which has a structure in which a polygonal columnar substrate holder (rotating drum)...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35C23C14/54
Inventor 志堂寺荣治安藤英一山田朋广真下尚洋
Owner AGC INC