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Wafer structure of projection definization

A technology of bumps and wafers, which is applied in the field of semiconductor wafer structures, can solve problems such as weakening of bump bonding strength, lack of suitable structures for general products, and inconvenience

Active Publication Date: 2009-11-25
ULTRA CHIP INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

When the number of the bumps 120 is required to increase, the size of the bumps 120 is reduced synchronously, resulting in weakening of the bonding strength of the bumps.
[0009] It can be seen that the above-mentioned existing bumped wafer structure obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general products do not have a suitable structure to solve the above-mentioned problems. Urgent problem

Method used

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  • Wafer structure of projection definization
  • Wafer structure of projection definization
  • Wafer structure of projection definization

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Embodiment Construction

[0045] In order to further illustrate the technical means and effects adopted by the present invention to achieve the predetermined purpose of the invention, the following describes the specific implementation, structure and features of the bump fingered chip structure proposed in accordance with the present invention with reference to the accompanying drawings and preferred embodiments. and its efficacy, as detailed below.

[0046] see Figure 4 and Figure 5 shown, Figure 4 is a schematic cross-sectional view of a bump fingered wafer structure according to an embodiment of the present invention; Figure 5 is a partial schematic view of the top surface of the bump fingered wafer structure. According to an embodiment of the present invention, a bump fingered wafer structure is disclosed. The bump-fingered chip structure 200 mainly includes a chip body 210 and a plurality of finger-shaped bumps 220 or / and bumps 240 .

[0047] The above-mentioned chip body 210 has an activ...

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Abstract

The invention relates to a wafer structure of bump fingerization, which mainly comprises a wafer body and a plurality of fingery bumps. The wafer body is provided with a plurality of connecting pads. The fingery bumps are arranged on the wafer body with bump shapes, each fingery bump is provided with a bump block and an extension part, the bottom covering area of the bump blocks is arranged in the connecting pads, and the bottom covering area of the extension parts is beyond the connecting pads. Therefore, under the condition of not increasing the size of the wafer, more fingery bumps can be collocated in micro-interval, and bonding strength of the bumps can not be influenced.

Description

technical field [0001] The invention relates to a semiconductor wafer structure, in particular to a bump that can be configured with more finger-shaped bumps without increasing the size of the wafer without affecting the bonding strength of bumps, and can meet the requirements of high-density arrangement of bumps Fingered wafer structure. Background technique [0002] Metal bumps, such as gold bumps, are fabricated on the pads of the integrated circuit chip to facilitate external electrical connection, which is convenient for subsequent applications in chip on glass (COG, Chip On Glass) and thin film on chip packaging (COF, Chip On Film) and other semiconductor products. The electronic signal is transmitted to the matching device, such as a liquid crystal display, through the bumps located on both sides of the integrated circuit chip and the substrate leads. With the high image quality and high resolution required by the display, the number of bumps required by the chip re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/485H01L23/50
CPCH01L24/14H01L2224/14051H01L2224/14H01L2924/14H01L2924/00H01L2924/00012
Inventor 施合成王俊元郑怡芳王琼琳锺孙雯
Owner ULTRA CHIP INC
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