Wafer structure possessing finger-like projection connected with multi-window

Abstract

The invention relates to a chip structure having fingerlike bumps bonded on multi-windows. The fingerlike bumps are arranged on a chip body having a plurality of pads and a surface protective layer, the surface protective layer is provided with a plurality of openings locally exposing each pad, and the openings can be in linear arrangement, parallel arrangement or rectangular arrangement. The fingerlike bumps in the shape of a projection are arranged on the chip body, each fingerlike bump is provided with a bump body and an extension portion, a covering area of the bottom of the bump body is located in the corresponding pad for covering the corresponding group of openings, and the covering area of the bottom of the extension portion is arranged over the pads for maintaining joint strength of the bumps with fine pitches. In an embodiment, the covering areas of the bottom of the extension portions cross at least one tracing line. The chip structure meets the requirements on the fin pitches of the bumps or / and high-density arrangement without affecting the joint strength of the bumps. The chip structure can increase the amount of joints of the pads of the chip, increases the crack resistant property of the bottom of the bumps, disperses skin areas on the top of the bumps, and can increase the joint strength of the bumps.

Description

technical field [0001] The present invention relates to a bumped semiconductor wafer structure, in particular to a structure that can meet the requirements of fine-pitch or / and high-density arrangement of bumps, and can also improve the joint strength of bumps and has a finger jointed on multiple windows. IC CHIP HAVING FINGER-LIKE BUMPSBONDED ON MULTI-WINDOWS. Background technique [0002] Metal bumps, such as gold bumps, are made on the pads of integrated circuit chips to facilitate external electrical connection, and to facilitate subsequent application in chip-on-glass (COG, Chip On Glass) and chip-on-thin film packaging (COF, Chip On Film) and other semiconductor products. The electronic signal is transmitted to the matching device through the bumps and substrate leads located on both sides of the integrated circuit chip, such as a liquid crystal display. With the high image quality and high resolution required by the display, the number of bumps required by the chip ...

AI Technical Summary

Problems solved by technology

When the number of the bumps 120 is required to increase, the bonding area of ​​the top surfaces of the bumps 120 is also reduced synchronously, resulting in weakening of the bonding strength of the bumps.

[0006] It can be seen that the above-mentioned existing bumped wafer structure obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general product has no suitable structure to solve the above-mentioned problems. This is obviously the relevant industry. Urgent problem

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