Heat dissipating device

Abstract

This invention provides one dissipation device for one display card with relative first and second planes, wherein, the dissipation device at least comprises several dissipation fins and one back board structure; the dissipation fins is set on first plane and the back board structure is set on second plane with at least on protruding edge to one heat source on second plane; this invention can form weld connection to add its conductive path and area on electron parts on second plane or first plane.

Description

Technical field: [0001] The present invention relates to a heat dissipation device, in particular to the technical field of using a backplane structure with at least one flange to fit a heat source on the back of a display card. Background technique: [0002] With the advent of the multimedia era, relevant multimedia information has been used in various electronic products such as computers or consumer products. In this regard, how the graphics card can satisfactorily display the computing results of these computers or consumer electronic products, and then display the high-speed computing on the screen or other display devices, has become a necessary requirement in the market. As expected by the public, the processing speed of the current graphics cards on the market has indeed gradually caught up with the requirements of the market. In fact, in order to achieve the processing speed required by the processors on these graphics cards, the processors on the graphics cards al...

AI Technical Summary

Problems solved by technology

However, the outer wall of the above-mentioned heat pipe and the inner wall of the above-mentioned heat dissipation base are usually not in close contact, so that only a relatively small heat source conduction area can be maintained between the heat conduction pipe and the heat dissipation base, thus affecting its heat conduction effect

[0010] (3) The heat dissipation fins in the heat dissipation device need to be extended and carried by the heat dissipation base, so that it is impossible to flexibly allocate the heat dissipation fins to the electronic components on the display card or their possible heating edges, for example Divide the blocks of heat dissipation fins and can be elastically distributed and intermingled between the electronic components on the display card

This usually makes the heat source on the graphics card unable to effectively dissipate heat through its cooling device, and may easily cause damage to the electronic components on the graphics card due to insufficient heat dissipation

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