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Large-power light-emitting diodes and its fluorescent-powder coating method

A technology of light-emitting diodes and phosphors, which is applied to electrical components, electric solid-state devices, circuits, etc., can solve the problems of uneven light-emitting color of high-power light-emitting diodes, inconsistent spacing between chips and phosphor particles, and phosphor precipitation, etc., to achieve luminescence The efficiency will not decrease, the energy saving effect is remarkable, and the effect of not easy to degrade

Active Publication Date: 2011-06-15
浙江古越龙山电子科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] But this kind of white light method is to mix traditional resin with phosphor, because the density of phosphor is relatively high (4.3±0.1 microns), and the density of the resin mixed with it is small, so the phosphor will definitely produce precipitation, which will affect its uniformity
In addition, the Blu-ray chip has a square shape. After being coated with ordinary glue, an arc-shaped phosphor mixture will be produced, resulting in inconsistent spacing between the chip and the phosphor particles, and uneven coating such as yellow circles or blue circles. The nearby phosphor particles decay quickly, so as the use time increases, the light-emitting color of high-power light-emitting diodes will also be uneven

Method used

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  • Large-power light-emitting diodes and its fluorescent-powder coating method
  • Large-power light-emitting diodes and its fluorescent-powder coating method
  • Large-power light-emitting diodes and its fluorescent-powder coating method

Examples

Experimental program
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Effect test

Embodiment 1

[0015] Embodiment 1: as figure 1 As shown, a high-power light-emitting diode includes a chip 1, a wire 2, a bracket 3, a mixture of fluorescent powder and silica gel 4, a frame 5 and a silica gel 6, the chip 1 is connected to the bracket 3 through a wire 2, and the frame 5 is a small square transparent frame , and set in the middle of the bottom of the support 3, the chip 1 is set in the frame 5, the bottom of the chip 1 is connected to the support 3, the phosphor powder and silica gel mixture 4 is coated on the chip 1 in the frame 5, and the phosphor powder and silica gel mixture 4 is outside Also coated with silica gel 6, the chip 1 uses a Ni / Au nitride blue light-emitting diode chip with a band width of 2.5 nanometers and a wavelength of 462.5 to 465 nanometers. The ratio is fluorescent powder:silica gel=1:50.

Embodiment 2

[0016] Embodiment 2: as figure 1 As shown, the phosphor coating method of high-power light-emitting diodes is:

[0017] a. Core expansion: expand the core plate to make the spacing meet the production requirements,

[0018] b. Set the border: set a small square transparent border 5 on the bracket 3, and set it in the middle of the bottom of the bracket 3,

[0019] c. Dot silver glue: Dot silver glue on the high-power light-emitting diode bracket 3 circuit in the small square transparent frame 5,

[0020] d. Solid crystal drying: Paste the chip 1 on the silver glue, and then dry and solidify at a temperature of 150°C-180°C.

[0021] e. Cleaning: use plasma ion spray to clean the surface of support 3 and chip 1,

[0022] f. Welding wire: Use ultrasonic welding wire 2 to connect the positive and negative poles of chip 1 to high-power circuit support 3,

[0023] g. Glue dispensing: Coat the chip 1 in the small square transparent frame 5 with the phosphor powder and silica gel ...

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Abstract

The invention is concerned with the high-power light-emitting diode and the fluorescence powder coating method. It consists of the chip, the lead, the bracket, the compound of the fluorescence powder and the silica gel, the silica gel and the border, the chip connects with the bracket by the lead, the border sets on the bracket, the chip sets in the border, the bottom of the chip connects with the border, coatings the compound of the fluorescence powder and the silica gel on the chip that is in the core plate, coatings the silica gel out of the compound of the fluorescence powder and the silica gel. The manufacture technisc is: extends core - sets border - dots silver gel -curing crystal and drying - clears - welds line - dots gel - curing - second dots gel - curing silicon gel - pressings - devices light and color.

Description

technical field [0001] The invention relates to a light-emitting diode and a coating method thereof, in particular to a high-power light-emitting diode and a coating method thereof. Background technique [0002] The so-called white light is a mixture of multiple colors. In the form of white light that can be seen by human eyes, at least two kinds of light must be mixed, such as two-wavelength light (blue light + yellow light) or three-wavelength light (blue light + green light + Red light), currently commercialized products only have two-wavelength blue light single-chip plus yellow phosphor. For example, white light-emitting diodes (LEDs) will replace fluorescent lamps, U-shaped energy-saving light bulbs, and liquid crystal display (LCD) backlights as new light sources in the future, which can greatly reduce power consumption and truly be environmentally friendly. [0003] In terms of technology, the current main light-emitting method of white light-emitting diodes (LEDs) ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/50
CPCH01L2224/48091H01L2224/8592H01L2924/181
Inventor 丁申冬许振军陈建伟陈丹萍张伟刚
Owner 浙江古越龙山电子科技发展有限公司