IC colloid bend adjusting instrument
A bending and colloidal technology, which is applied in the field of IC colloidal bending adjustment jigs, can solve problems such as bruising, inability to reduce loss, unfavorable handling, etc., to avoid dumping, injury, and reduce the chance of IC colloid wear and damage, and reduce fixtures effect of weight
Inactive Publication Date: 2008-01-02
FORMOSA ADVANCED TECH
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Problems solved by technology
[0007] Since the heavy pressing block (90) is a heavy iron block up to 6-10 kg (each material box), if the iron block is not handled with care, it will easily cause colloidal cracks and be unfavorable for handling; Be careful, then it will cause the heavy pressure block (90) to fall to the ground and injure the carrier's feet (or when taking out the heavy pressure block), and it is easy to cause the previous colloid and the next colloid to be unable to move through shaking during transportation. If the colloids are actually stacked out of their proper stacking position, the weight block will not be able to evenly distribute the force to each IC colloid, thus failing to reduce the lack of colloid warpage in the industry, and the IC ( 60) It is also a high unit price product. If it is damaged or the colloid is too large to bend and cause bad products, it will cause a loss in turnover
Method used
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Embodiment Construction
[0022] Please refer to Fig. 1, the IC colloid bending adjustment fixture of the present invention includes:
[0023] A feed box (10), its inside forms the accommodating space (101) that places for IC colloid (60) (referring to Fig. 2), and forms an opening that communicates with accommodating space (101) at the top side, feed box ( 10) A handle (12) is provided on the rear wall close to the top side, which is convenient for carrying and carrying; one side plate is provided on both sides of the material box (10), and the two side plates form a stop on the front side of the material box (10). (102), and more than one set of corresponding positioning holes (11) are provided on the surface of the two side plates close to the opening end;
[0024] A top bracket (20), located at the bottom of the housing space (101) of the magazine (10), includes two parallel bearing plates (21) / (22) and a plurality of bearing plates (21) / (22) for the elastic element (23), the bearing plate (21) / (...
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The invention relates to a bending adjustment tool of IC colloid for modifying the bad status that IC single colloid has warpage after molding of various whole IC products is accomplished. The tool comprises material box with accommodating space; plural corresponding positioning holes set at two sides; a top support set at the bottom of accommodating space; a guide bar passing through positioning holes at two sides of material box, of which on the body a radial perforative combining hole is set; a top pushing bar with adjusting configuration combined with combining hole of guide bar; and a press plate set in the accommodating space and pushed by the top pushing bar.
Description
technical field [0001] The present invention relates to an IC colloid bending adjustment jig, in particular to an IC colloid bending adjustment jig that is convenient for transporting the jig and using the necessity of baking in the high temperature process of the oven to adjust the warping deformation of the colloid to the best flatness. Tool. Background technique [0002] At present, after chip dicing, each packaging factory places IC glue on the IC material box after chip packaging (molding), and then places a heavy pressure block to overcome the bending of the glue. The bending of the colloid is mainly caused by the packaged IC, which is caused by the different design and composition of the material (chip size, lead frame or substrate, resin) and the degree of thermal bending of the colloid; more specifically, the packaged IC The colloid is hot. When the colloid cools down slowly, the colloid, the internal chip and the lead frame will shrink. Once the colloid shrinks, t...
Claims
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IPC IPC(8): B29C53/16H01L21/67H01L21/687
Inventor 詹信忠
Owner FORMOSA ADVANCED TECH