Method for producing paster type antenna

A manufacturing method and antenna technology, applied in the direction of antenna, antenna components, radiating element structure, etc., can solve problems such as unfavorable competition, price Anger, separation of copper and Mylar, etc., to reduce labor costs and increase stability.

Inactive Publication Date: 2008-01-02
AUDEN TECHNO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high price of beryllium copper, the cost of the sticker antenna is very high, which is not good for competition
[0003] Furthermore, the sticker antenna must be covered with a layer of Mylar (a polyester film) for protection, but since Mylar is only bonded to copper during the manufacturing process, the disadvantage of copper and Mylar separation sometimes occurs during operation. Improve

Method used

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  • Method for producing paster type antenna
  • Method for producing paster type antenna
  • Method for producing paster type antenna

Examples

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Embodiment Construction

[0019] See also Fig. 1, the manufacturing method flowchart of the present invention, its step comprises:

[0020] a. Cut the bare copper foil into tapes of appropriate width and cover with adhesive and release film;

[0021] b. The treated copper foil is brush-plated in the form of strips, first nickel-plated and then gold-plated;

[0022] c. Brush the plated copper foil, punch the shape (Pattern), and punch positioning holes on the release film at the same time;

[0023] d. After the copper foil is formed, the Mylar semi-finished product with glue is first pasted by the way of positioning holes;

[0024] e. After the cladding is completed, the copper foil is adhered to the back of Mylar, and the Mylar (containing copper foil) is separated from the release film;

[0025] f. Cover the back of Mylar (including copper foil) with adhesive;

[0026] g. Locate with the positioning hole and reattach to the release film; and

[0027] h. Punching and cutting Mylar to form and remov...

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Abstract

A production method of paster antenna comprises that first adhering one layer of parting film on a copper foil at 0.017mm thick, therefore the copper foil can bear the drawing force in brush plating, to replace prior beryllium copper with high thickness, punching the plated copper foil to be adhered with a Mylar half-finished product, to adhere the copper foil on the back of Mylar, separating the Mylar copper foil from the parting film, adhering glue on the back of the Mylar, to be adhered with the parting film, punching and shaping the Mylar, removing edge, to produce paster antenna.

Description

technical field [0001] The present invention relates to a method for manufacturing a sticker antenna, in particular to a method for manufacturing a sticker antenna with a copper foil with a thickness of 0.017 mm. Background technique [0002] Sticker-type antennas are conveniently assembled in mobile phones or mobile electronic devices that require volume reduction. The traditional sticker antenna is made of beryllium copper with a thickness of 0.1mm, because only beryllium copper with this thickness can withstand the pulling force required in the subsequent brush plating process. Due to the high price of beryllium copper, the cost of the sticker antenna is very high, which is not conducive to competition. [0003] Furthermore, the sticker antenna must be covered with a layer of Mylar (a polyester film) for protection. However, since Mylar is only bonded to copper during the manufacturing process, the disadvantage of copper and Mylar separation sometimes occurs during opera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/00H01Q1/38
Inventor 林俊玮黄栋樑
Owner AUDEN TECHNO
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