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DC power layer structure

A technology of DC power supply and layer structure, which is applied in the directions of printed circuit components and printed electrical components, etc., can solve the problems of high-frequency noise, complex manufacturing process, high production cost, etc.

Inactive Publication Date: 2010-06-23
INVENTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The technical problem to be solved by the present invention is to provide a DC power layer structure that suppresses high-frequency noise, so as to solve the problem that the method of cutting the power layer in the prior art can only suppress low-frequency noise but generate high-frequency noise resonance , but can not suppress the problem of high-frequency noise, and reduce the high production cost due to the use of a large number of capacitors in the prior art, and solve the problem of difficult circuit layout and complicated manufacturing process

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Embodiment Construction

[0024] In order to have a further understanding of the purpose, structure, features, and functions of the present invention, the following detailed descriptions are provided in conjunction with the embodiments.

[0025] First, refer to FIG. 3, which is a top view of the first embodiment of the present invention. As shown in FIG. 3 , the power layer 110 has a DC power supply 30 and an input / output port 114 for connecting a transmission line to another circuit board to transmit or receive a signal. The power layer 110 is divided into two parts, namely a first circuit area 111 and a second circuit area 112 , which are electrically connected by a noise filter 113 , and an energy gap structure 116 is formed on the second circuit area 112 .

[0026] An energy gap structure 116 is formed in the second circuit region 112 of the power supply layer 110. The energy gap structure 116 is, for example, an electromagnetic band gap structure (Eletromagnetic Band Gap; EBG) or a photonic band g...

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Abstract

The invention discloses a DC power layer structure, being used for a multi-layer circuit board, including a first circuit area used to input a DC power; a noise filter, one end of the noise filter is electric connected with the DC power output end of the first circuit area; a second circuit area which is electric insulated with the first circuit area; an energy gap structure is arranged at the second circuit area, and the DC power input end of the energy gap is electric connected to the other end of the noise filter to restrain the high-frequency noise of the multi-layer circuit board.

Description

technical field [0001] The invention relates to a DC power layer structure, in particular to a DC power layer structure for suppressing noise between multilayer circuit boards. Background technique [0002] In recent years, as the public's demand for information transmission speed has become faster and faster, the frequency of the transmitted signals has also become higher and higher. Therefore, the design of high-frequency digital circuits has become a major development field of circuit design, and is constantly developing towards higher-speed, smaller-volume, and lower-voltage designs. Due to the demand for small volume, multilayer printed circuit boards are widely used in circuit design. However, when the frequency of transmission signals is getting higher and higher, between the power plane (Power Plane) and the ground plane (Ground Plane) of multilayer printed circuit boards (Ground Plane) Generate noise and affect the quality of signal transmission. Therefore, effect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/16
Inventor 陈彦豪赖俊佑
Owner INVENTEC CORP