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Method of packaging white LED

A technology of light-emitting diodes and packaging methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of long time-consuming packaging process and high temperature, and achieve the effect of improving efficiency and saving energy

Inactive Publication Date: 2008-05-21
JINAN UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention provides a packaging method for white light-emitting diodes, aiming at the problems that the packaging process of light-emitting diodes in the prior art takes a long time and requires high temperature.

Method used

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  • Method of packaging white LED

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Embodiment Construction

[0016] As shown in Figure 1, the packaging process of the present invention is as follows: the light-emitting diode chip 3 and its holder 1 are immersed in the photosensitive resin 2 doped or coated with phosphor and photopolymerization initiator, and the working current 4 is passed to In the light-emitting diode die 3, the light-emitting diode is made to emit light, and the photosensitive resin 2 is then excited to polymerize to encapsulate the diode chip 3 and its support 1 to finally form a light-emitting diode.

[0017] The invention realizes the adjustment of the light emission uniformity of the light emitting diode by adjusting the uniformity of the phosphor powder. The self-luminous characteristics of the light-emitting diode die can be adjusted by adjusting the light-emitting time and current of the chip, such as light-emitting uniformity, light-emitting time, light-emitting intensity, etc., so as to realize the adjustment of the uniformity of the phosphor, so that the res...

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Abstract

The invention discloses an encapsulation method of white light emitting diodes. The invention is characterized in that an LED chip and a support of the LED chip are immerged in photosensitive resin doped or smeared with phosphor powder and photopolymerization initiator, and a working current is connected to the tube core of the LED to make the tube core illuminant, and then the photosensitive resin is excited to generate polymerization and encapsulate the LED chip and the support. The invention has the advantages of short preparation time of the LED without molds and high temperature, improving efficiency, saving energy sources, automatically adjusting the distribution of the phosphor powder according to luminescence property of the chip, easily realizing specific coating of the phosphor powder and then achieving uniform white-light emitting or spectral specific emitting.

Description

Technical field [0001] The invention belongs to the technical field of light-emitting diode packaging, and particularly relates to a method for packaging a white light-emitting diode. Background technique [0002] Due to the technological breakthrough of light-emitting diodes, especially with the breakthrough of GaN crystal epitaxial preparation technology, major breakthroughs have been made in the quality and brightness of light-emitting diodes, making the trend of using light-emitting diodes to replace current indoor lighting lamps more obvious. In the current process of light source revolution, the method of preparing light-emitting diodes is very important. Because different environments have different requirements for the light-emitting characteristics of light-emitting diodes, it is required to produce light-emitting diodes with various parameters quickly and at low cost. [0003] The use of photosensitive resin can quickly and economically encapsulate light-emitting diodes...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
Inventor 王浩蔡继业
Owner JINAN UNIVERSITY
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