Unlock instant, AI-driven research and patent intelligence for your innovation.

Probe card

A probe card and probe technology, applied in the field of probe cards, can solve the problems of low durability, weak joint strength, deformation of support beams, etc. of MEMS probe cards, and achieve the effect of reducing test failure rate and improving stability

Inactive Publication Date: 2008-06-04
KOMICO
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] However, in conventional MEMS probe cards, when the bumps and support beams are heated and cooled during the bonding process, positional errors may occur between the bumps and the support beams
In addition, conventional MEMS probe cards may deform and deflect the support beam due to the weak joint strength between the bump and the support beam during repeated use.
Therefore, the durability of traditional MEMS probe cards may be low

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Probe card
  • Probe card
  • Probe card

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0038] FIG. 1 is a cross-sectional view illustrating a probe card according to a first exemplary embodiment of the present invention, and FIG. 2 is a perspective view illustrating the probe card in FIG. 1 .

[0039]1 and 2, the probe card of this exemplary embodiment includes a substrate 101 having a circuit pattern 102, a bump 110 formed on the pattern 102, and a plurality of probes 120 having a first end and a second end, A tip 122 contacting the semiconductor device is formed at a first end, and a second end opposite to the first end is combined with a bump 110 .

[0040] In addition, the probe card further includes a bonding part 130 for fixing the bump 110 and the probe 120 to each other, so as to electrically couple the bump 110 and the probe 120 to each other.

[0041] Here, the probe card can be used as a space expansion device for electrically coupling a semiconductor device having pads arranged at a first pitch to a semiconductor device having pads arranged at a seco...

Embodiment approach 2

[0059] 3 is a cross-sectional view illustrating a probe card according to a second exemplary embodiment of the present invention, and FIG. 4 is a perspective view illustrating the probe card in FIG. 3 .

[0060] In Exemplary Embodiment 1, the first coupling part 131 is inserted into the second coupling part 132 . In contrast, in the present exemplary embodiment, the second coupling part 232 is inserted into the first coupling part 231 .

[0061] Hereinafter, the probe card of this exemplary embodiment will be described in detail with reference to FIGS. 3 and 4 . Here, elements substantially the same as those in Exemplary Embodiments 1 and 2 are denoted by the same names, and any further explanation about the same elements is omitted here for brevity.

[0062] 3 and 4, the probe card of this exemplary embodiment includes: a substrate 201 having a circuit pattern 202; a bump 210 formed on the pattern 202; a plurality of probes 220 having a first end and a second end, A tip 222...

Embodiment approach 3

[0074] 5 is a cross-sectional view illustrating a probe card according to a third exemplary embodiment of the present invention, and FIG. 6 is a perspective view illustrating the probe card in FIG. 5 .

[0075] In this exemplary embodiment, unlike the structures in exemplary embodiments 1 and 2, the first binding part 231 for immobilizing the probe 320 is formed at the substrate 301 .

[0076] Hereinafter, the probe card of this exemplary embodiment will be described in detail with reference to FIGS. 5 and 6 . Here, elements substantially the same as those of Exemplary Embodiments 1 to 2 are denoted by the same names, and any further explanation about the same elements is omitted here for brevity.

[0077] 5 and 6, the probe card of this exemplary embodiment includes: a substrate 301 with a circuit pattern 302, a plurality of probes 320 with tips 322 in contact with semiconductor devices, and a probe card for connecting the substrate 301 with the probes. 320 are joint members...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a probe card comprising a substrate, a projection, a probe and a combination part. The projection is formed on the substrate. The probe comprises a supporting beam and the bulgy cusp of the first end of the supporting beam. The combination part connects the projection with the probe. The combination part comprises a first combination section and a second combination section surrounding the outer surface of the first combination part. Thereby, the probe of the probe card can be hard fixed in order that the probe card has an improved structural stability.

Description

[0001] Cross References to Related Applications [0002] This application claims priority under 35 USC §119 to Korean Patent Application No. 2006-118032 filed on November 28, 2006 with the Korean Intellectual Property Office (KIPO), the contents of which are hereby incorporated by reference in their entirety. technical field [0003] Exemplary embodiments of the present invention relate to a probe card for testing normal operation of a semiconductor device. More particularly, exemplary embodiments of the present invention relate to probe cards having improved probe bonding strength. Background technique [0004] Currently, information media such as computers have become widespread, and thus the development of semiconductor devices has advanced rapidly. In terms of the functions of the semiconductor device, the semiconductor device may require a high operation speed and a large memory capacity. In order to meet the above-mentioned requirements, semiconductor manufacturing p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/067G01R1/073
CPCG01R1/07314G01R31/2601
Inventor 高上基
Owner KOMICO