Reinforced shakeproof memory

Abstract

The invention relates to a memory of enhancing shock resistance, mainly comprising a printed circuit board with multilayer and a plurality of memory body encapsulation parts. The printed circuit board with multilayer generally presents a rectangular shape which has two relative long sides and two relative short sides, wherein a relative long side is provided with a plurality of golden fingers, and the two relative short sides respectively form and have at least a round arc-shaped groove and a plurality of first stress absorbing slot bores. Relatively excellently, another relative long side which is far from the golden fingers forms a plurality of second stress absorbing slot bores. The plurality of memory body encapsulation parts are arranged on a surface of the printed circuit board with multilayer. By using the first stress absorbing slot bores and / or the second stress absorbing slot bores to buffer wallop, the invention can effectively avoid the problem of product invalidation due to electric open circuit occurring when the memory falls down.

Description

technical field [0001] The present invention relates to a kind of memory, in particular to a kind of memory with enhanced anti-vibration, which can make the printed circuit board buffer the impact force by using stress absorbing slots, and prevent the problem of product failure caused by electrical disconnection when the memory is dropped. Background technique [0002] In computer mainframes, notebook computers and other electronic products, memory (memory, memory is the memory module, hereinafter referred to as memory) is a key component, which can be repeatedly plugged into the memory slot of the motherboard (ie memory slots, hereinafter referred to as memory slots), are used for computing of the computer system. During the process of carrying, transporting and replacing, the memory may accidentally drop to the ground. However, the current memory is not very drop-resistant, and it is often damaged due to failure. [0003] see figure 1 Shown is a schematic top view of a c...

AI Technical Summary

Problems solved by technology

[0008] The main purpose of the present invention is to overcome the defects of the existing memory and provide a memory with a new structure with enhanced shock resistance. The technical problem to be solved is to make the printed circuit board able to buffer the impact force by using stress absorption slots , can prevent the problem of product failure due to electrical disconnection when the memory is dropped, and is very suitable for practical use

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