Unlock instant, AI-driven research and patent intelligence for your innovation.

Device and method for positioning and blocking thin substrates on a cut substrate block

A substrate and distance-keeping technology, applied in the field of silicon wafer devices, can solve problems such as separation difficulties

Inactive Publication Date: 2008-06-04
SCHMID TECH SYST
View PDF1 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the wafer is gradually separated from the support glass plate, they lie entirely on the underlying wafer, which makes separation more difficult

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device and method for positioning and blocking thin substrates on a cut substrate block
  • Device and method for positioning and blocking thin substrates on a cut substrate block
  • Device and method for positioning and blocking thin substrates on a cut substrate block

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The device 10 or 10' shown in the figures according to the two embodiments is used for positioning and holding a thin substrate after wire sawing of a substrate block, preferably for positioning and holding a silicon wafer block 13 wire sawing After the thin silicon wafer 14. The wafer block 13 and the still glued carrier glass plate 11 fastened to the base plate 12 are uniformly cut into thin wafers 14 with a thickness of at most 0.3 mm up to the surface of the carrier glass plate 11 by means of a wire saw. The device 10 or 10 ′ serves at the same time to separate the wafers 14 from the wafer blocks 13 in a simple and rapid manner and to transport them to further processing plants.

[0025] Wafers 14 of the diced wafer block 13 are placed in a cassette 17 so as to be suspended from the support glass plate 11 . In this respect, the wafer 14 is still arranged with the distance of forming the cutting slit 15 on its bonding location 25, and on its lower edge 26 away from ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed is a device (10) for positioning and blocking thin silicon wafers (14) after wire-sawing a silicon wafer block (13). Said device (10) comprises a cassette (17) that accommodates the wafer block (13) and is provided with two contact strips (20) whose sides facing the wafer block (13) encompass elements (32, 33, 34, 36) which engage into the narrow cutting gap (15) between the wafers (14) so as to maintain the distance and provide support. This allows the wafers to be fixed in the position thereof even after removing a supporting glass plate (11) such that particularly the gap (15) in the area of the former connecting point (25) to the removed supporting glass plate (11) is maintained and the subsequent singulation process is simplified.

Description

technical field [0001] The present invention relates to a device and method for positioning and holding a thin substrate after a substrate block has been cut, preferably a device and a method for positioning and holding a silicon wafer after a linear sawn of a silicon wafer block, The device and the method are as described in the preamble of claim 1 and claim 17 respectively. Background technique [0002] For photovoltaic cells in particular, very thin wafers of less than 0.3 mm in thickness need to be cut out of silicon blocks using wire saws. For this purpose, the silicon block is firstly bonded to the carrier glass pane, which is then connected to the frame rail. A plurality of wire saws simultaneously traverses the wafer block and cuts right down to the glass of the carrier glass pane. The individual wafers thus only remain fixedly suspended on the adhesive layer corresponding to the thickness of the wafers. Leave the cutting gap at this location. Since the wafers mu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00B23D57/00H01L21/67
CPCB28D5/0082Y10T83/6571Y10T83/0467B28D5/00B23D57/00H01L21/67H01L21/68
Inventor 约瑟夫·真蒂舍尔迪尔克·哈伯曼
Owner SCHMID TECH SYST