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Less qualified solder pad space length detection device and method

A technology of spacing and pads, which is applied in the field of unqualified pad spacing detection devices, can solve the problems that PCB boards cannot be produced and reduce the production efficiency of PCB boards, etc.

Inactive Publication Date: 2012-07-25
RUIJIE NETWORKS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Figure 1a It is a schematic diagram of the first pad spacing of different components on the PCB, Figure 1b It is a schematic diagram of the second pad spacing of different components on the PCB. If the pad spacing is not within the allowable spacing range of the production process, it may cause the PCB board to fail to be produced and reduce the production efficiency of the PCB board.

Method used

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  • Less qualified solder pad space length detection device and method
  • Less qualified solder pad space length detection device and method
  • Less qualified solder pad space length detection device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0036] Embodiment 1. The unqualified pad pitch detection device 10 automatically detects pad pitches that do not conform to the allowable range of the production process and are formed by pads of different components as unqualified pad pitches.

[0037] In order to identify whether the measured pad spacing is formed by pads of different components, in the detection process, a judgment process can be introduced, and the unqualified pad spacing detection device 10 can determine whether the measured pad spacing is formed by pads of different components. form.

[0038] This judging process can be carried out when the spacing measurement unit 11 measures the spacing between the pads, that is, in the above step 1, or after the unqualified spacing determination unit 13 determines that the measured spacing between the pads does not belong to the range allowed by the production process, that is, It is executed in step 3, and examples of the two cases are given below.

Embodiment 1

[0039] Embodiment 1. The spacing measuring unit 11 judges whether the pad spacing is formed by pads of different components, and if so, measures the spacing.

[0040] Figure 4 It is an implementation process diagram of the first embodiment of the present invention, in conjunction with this figure, it can be seen that the implementation process of the first embodiment of the present invention is as follows:

[0041] In step a1, the spacing measurement unit 11 reads the attribute information of a pad; the attribute information includes the component identification information of the component to which the pad belongs;

[0042] Step a2, the spacing measurement unit 11 reads the attribute information of another pad;

[0043] Wherein the pad attribute information can be read by the function that the spacing measurement unit 11 calls the software. For example, based on the PCB design and routing tool ALLEGRO software, the spacing measurement unit 11 can complete the reading of the...

Embodiment 2

[0076] In the second embodiment, after it is detected that the spacing between the pads is not within the range allowed by the process, if the spacing between the pads is formed by pads of different components, it is determined that the spacing is unqualified.

[0077] Image 6 It is an implementation process diagram of the second embodiment of the present invention. In conjunction with this figure, it can be known that the implementation process of the second embodiment of the present invention includes:

[0078] Step b1, the pitch measurement unit 11 reads the property information of a pad;

[0079] Step b2, the spacing measurement unit 11 reads the attribute information of another pad;

[0080] Step b3, the spacing measurement unit 11 measures the spacing between the two pads according to the attribute information;

[0081] Step b4, the pitch comparison unit 12 judges whether the pitch between the two pads is within the range allowed by the production process, if not, go ...

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PUM

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Abstract

The invention discloses a detection device for detecting spaces between unqualified bonding pads and a method thereof to realize the space detection of the unqualified bonding pads. The device comprises a space measurement unit for measuring space of the bonding pads in the measure gerber file based on the PCB design software; a space comparing unit for comparing the space of the bonding pads measured by the space measurement unit with the allowable range of production process; and an unqualified bonding pad determining unit for determining the space measured by the space measurement unit unqualified when the measured space of the bonding pads is out of the allowable range of production process after comparison by the space comparing unit. The method comprises the following steps of: measuring the space of the bonding pads by the space measurement unit; comparing the bonding pad space measured by the space measurement unit with the allowable range of production process; and determining the space measured by the space measurement unit unqualified when the measured bonding pad space is out of the allowable range of production process after comparison by the space comparing unit.

Description

technical field [0001] The invention relates to the field of electronic circuits, in particular to a detection device and method for unqualified pad spacing. Background technique [0002] At present, the number of devices on the printed circuit board (PCB, Print Circuit Board) is increasing, and the board density is increasing. Therefore, when placing devices on the circuit board, it is likely that the pad spacing between different components is too small to meet The requirements of the production process. [0003] Figure 1a It is a schematic diagram of the first pad spacing of different components on the PCB, Figure 1b It is a schematic diagram of the second pad spacing of different components on the PCB. If the pad spacing is not within the allowable spacing range of the production process, it may cause the PCB board to fail to be produced and reduce the production efficiency of the PCB board. [0004] Therefore, there is an urgent need for a solution capable of detect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B21/16
Inventor 朱秀珠
Owner RUIJIE NETWORKS CO LTD