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Chemical plating silver copper powder, chemical plating liquid and chemical plating method

A technology of chemical silver plating and copper powder, which is applied in the direction of liquid chemical plating, coating, metal material coating process, etc., can solve the problem of repeated silver plating, poor stability of plating solution, and affecting the oxidation resistance of silver-plated copper powder , conductivity and other issues, to achieve the effect of uniform distribution of silver layer, increase of silver coating rate and high binding force

Inactive Publication Date: 2010-06-16
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned patents and documents have problems such as poor stability of the plating solution, repeated silver plating, and no control and adjustment of the silver coating rate of the copper powder, etc., which in turn affect the oxidation resistance, conductivity, and other problems of the silver-plated copper powder. application etc.

Method used

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  • Chemical plating silver copper powder, chemical plating liquid and chemical plating method
  • Chemical plating silver copper powder, chemical plating liquid and chemical plating method
  • Chemical plating silver copper powder, chemical plating liquid and chemical plating method

Examples

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Effect test

Embodiment 1

[0026] Example 1: Put 15g of copper powder into a glass container, add a certain amount of absolute ethanol, and stir for 1 hour with a temperature-controlled magnetic stirrer. Wash the copper powder with distilled water for 2 times, then wash the copper powder with 3% dilute HCl, and then wash the copper powder with distilled water for 3 times. Copper powder is put into the sensitization solution (stannous chloride 10g / L; Hydrochloric acid 30g / L; Distilled water surplus) container that places ultrasonic generator to carry out sensitization treatment, ultrasonic frequency is 40kHz, ultrasonic power is 110W, temperature The temperature is 20°C, the sensitization time is 5min, and the copper powder is washed twice with distilled water. Copper powder is put into the activation solution (palladium chloride 0.5g / L; Hydrochloric acid 25g / L; Distilled water surplus) container that places ultrasonic generator and carry out activation treatment, ultrasonic frequency is 40kHz, ultrasoni...

Embodiment 2

[0027] Example 2: Put 15g of copper powder into a glass container, add a certain amount of absolute ethanol, and stir for 1 hour with a temperature-controlled magnetic stirrer. Wash the copper powder with distilled water for 2 times, then wash the copper powder with 3% dilute HCl, and then wash the copper powder with distilled water for 3 times. Copper powder is put into the sensitization solution (stannous chloride 12g / L; Hydrochloric acid 30g / L; Distilled water surplus) container that places ultrasonic generator to carry out sensitization treatment, ultrasonic frequency is 40kHz, ultrasonic power is 110W, temperature The temperature is 20°C, the sensitization time is 5min, and the copper powder is washed twice with distilled water. Copper powder is put into the activation solution (palladium chloride 0.5g / L; Hydrochloric acid 25g / L; Distilled water surplus) container that places ultrasonic generator and carry out activation treatment, ultrasonic frequency is 40kHz, ultrasoni...

Embodiment 3

[0028] Example 3: Put 30 g of copper powder into a glass container, add a certain amount of absolute ethanol, and stir with a temperature-controlled magnetic stirrer for 1 hour. Wash the copper powder with distilled water for 2 times, then wash the copper powder with 3% dilute HCl, and then wash the copper powder with distilled water for 3 times. Copper powder is put into the sensitization solution (stannous chloride 15g / L; Hydrochloric acid 40g / L; Distilled water surplus) container that places ultrasonic generator and carry out sensitization treatment, ultrasonic frequency is 40kHz, ultrasonic power is 110W, temperature The temperature is 20°C, the sensitization time is 5min, and the copper powder is washed twice with distilled water. Copper powder is put into the activation solution (palladium chloride 0.8g / L; Hydrochloric acid 30g / L; Distilled water surplus) container that places ultrasonic generator and carry out activation treatment, ultrasonic frequency is 40kHz, ultrasoni...

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Abstract

The invention discloses a silver plating copper powder, a chemical plating liquid and a method of chemical plating; wherein, the silver coating ratio of the silver plating copper powder is 10 to 95%;the silver plating layer comprises 0.5 to 1.2wt% rare-earth metal cerium and / or lanthanum and / or yttrium; the chemical plating liquid comprises three independent components of silver nitrate water solution, formaldehyde ethanol solution and rare-earth nitrate water solution. The method of chemical plating is characterized in that (1) the copper powder is washed and is processed by ultrasonic sensitization and ultrasonic activation in sequence, and (2) the three components of the chemical plating liquid are added in sequence and the ultrasonic chemical plating is processed. The method of chemical plating has the advantages of utilizing the modification effect of rare-earth, raising the stability of plating liquid, the catalytic activity of copper powder surface and the reduction activity ofsilver ion, adjusting the silver coating ratio from 10% to 95% according to different demands, and even distribution, smooth surface and high conductivity and oxidation resistance of silver plating layer.

Description

1. Technical field [0001] The invention relates to a copper powder coated with an electroless plating layer on the surface and a preparation method thereof, in particular to a silver-plated copper powder, composition of an electroless plating solution and a method for electroless plating. 2. Background technology [0002] With the rapid development of electronics, information, and communication industries, the miniaturization, chipping, and multi-layering of electronic components are accelerating. For metal powders such as silver, gold, platinum, nickel, and copper as the main functional phase The demand for electronic paste (conductive coating, conductive adhesive) is also increasing, and electronic paste has been widely used in the electrodes of electronic components and shielding coatings to prevent electromagnetic interference. Silver-based conductive coatings are one of the earliest developed varieties, but they are expensive, and silver ions will undergo electromigrati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/02C23C18/44
Inventor 宣天鹏王翔通王政华马青山陆广广
Owner HEFEI UNIV OF TECH
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