Method for monitoring and predicting uniformity of a wafer and manufacture method of semiconductor wafer

Abstract

A method of monitoring uniformity of a wafer is provided. A wafer parameter is selected. Manufacturing data is collected. The manufacturing data includes measurements of the selected wafer parameter. An average offset profile of the wafer parameter for a first and second wafer is determined using the manufacturing data. The first and second wafer are associated with a product type and were processed by a processing tool. An offset profile for a third wafer is predicted for a wafer using the average offset profile. The third wafer is associated with the product type and was processed by the processing tool.

Description

technical field [0001] The invention relates to semiconductor manufacturing, in particular to a method for monitoring and predicting the flatness of a wafer and a method for manufacturing a semiconductor wafer using the method. Background technique [0002] Semiconductor integrated circuit substrates, such as wafers, are fabricated through multiple fabrication processes. These manufacturing processes, including the processing tools required to implement these manufacturing processes, are monitored and controlled to maintain the quality and yield of integrated circuits. As the size of integrated circuits decreases, so does their complexity, and so does the need to monitor different aspects of the die. However, adding monitoring consumes time and labor costs in the manufacturing process cycle, and additional measuring tools are required. One of the above cost-intensive potential monitoring requirements includes determining wafer parameters at different locations on the wafer...

AI Technical Summary

Problems solved by technology

However, adding monitoring consumes time and labor costs in the manufacturing process cycle and requires the use of additional measuring tools

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