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Apparatus and method for coating of a plastic substrate

A plastic substrate and thin film deposition technology, applied in the direction of metal adhesion improvement of insulating substrates, metal material coating process, ion implantation plating, etc., can solve the problem that the unfit metal layer has sufficient adhesion, so as to promote the follow-up The effect of chemical reactions

Inactive Publication Date: 2008-11-05
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] Apparently, known methods of pretreating plastic substrates are not suitable for providing sufficient adhesion of the deposited metal layer in the application of metallized plastic substrates, especially flexible circuit boards

Method used

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  • Apparatus and method for coating of a plastic substrate

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Embodiment Construction

[0029] The preferred embodiment and appended figure 1 Other features and advantages of the present invention, in particular of the thin film deposition machine of the present invention, can be understood with reference to the description given.

[0030] figure 1 is a schematic diagram of the main elements of a thin film deposition machine 1 for depositing a metal layer on a plastic film 2 according to one embodiment. The composite sheet 3 produced by the thin film deposition machine 1 is particularly suitable for use as a substrate for flexible printed circuit boards. The film deposition machine 1 has a pretreatment unit 4 for performing non-deposition pretreatment on the plastic film 2 , and the pretreatment unit 4 includes a first treatment area 5 and a second treatment area 6 . The film deposition machine 1 also has a first and a second deposition zone 7, 8 for deposition on the plastic film 2, wherein the zones 5, 6, 7, 8 are arranged in succession around a central depos...

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Abstract

Treatment of a plastic substrate comprises cleaning a surface of the plastic substrate with a non-reactive low energy plasma comprising argon at 0.05-1 W / cm2>; and activating the surface of the plastic substrate with a reactive high energy ion radiation. An independent claim is included for an apparatus for coating a plastic foil web, comprising a pretreatment unit placed before a deposition section along a process direction.

Description

technical field [0001] The invention relates to a method for depositing at least one metal layer on a plastic substrate, in particular on a plastic foil for a flexible printed circuit board, wherein the first layer is deposited on the surface of the plastic substrate to be deposited Previously, the surface was subjected to a non-depositional pretreatment. [0002] The invention also relates to a thin film deposition machine for depositing at least one metal layer on plastic films, in particular for flexible printed circuit boards, said deposition machine having said A pretreatment unit for the surface of the plastic film, said pretreatment unit being located upstream of the first deposition zone in the conveying direction of the plastic film through the film deposition machine. Background technique [0003] The method and apparatus described above are used to deposit usually multiple metal layers on plastic, preferably by sputtering. The plastic substrate metallized in thi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38C23C14/14C23C14/34
Inventor 彼得·索尔汉斯－乔格·罗茨
Owner APPLIED MATERIALS INC