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Electronic module and method for sealing an electronic module

An electronic module, potting technology, applied in the direction of sealing shell, electrical equipment shell/cabinet/drawer, circuit, etc., can solve problems such as electrical failure of electronic components

Inactive Publication Date: 2008-11-05
TK HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult for the usual potting process to create a sufficient barrier against the external environment along the current-carrying conductor
Moisture or exposure may cause electrical failure of the PCB or electronic components assembled on the PCB

Method used

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  • Electronic module and method for sealing an electronic module
  • Electronic module and method for sealing an electronic module
  • Electronic module and method for sealing an electronic module

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Embodiment Construction

[0015] Embodiments of the present invention will be described below with reference to the drawings. It should be appreciated that the following description is intended to describe exemplary embodiments of the invention, not to limit the invention.

[0016] figure 1 Shown is a perspective view of the electronics module housing 50 with the PCB 10 located therein. The connector 90 is connected to the housing 50 . The electronics module housing 50 can accommodate a large number of electronics such as crash sensors. For example, an airbag crash sensor typically includes a PCB with electronics, an integral housing 50 / connector 90 assembly, and mounting parts. Electronic modules, such as crash sensors, are housed in housing 50, which is made of a variety of materials to protect the electronic modules from water, moisture, or other environmental damage. The housing 50 and connector 90 assembly typically includes a polymer that provides good physical properties for the connector ap...

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PUM

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Abstract

A method and apparatus for sealing electronic module conductors is provided. Electronic modules typically consist of an electronic circuit board (''PCB'') with electronic components, an integral housing / connector assembly, conductors such as wires or terminal pins, and a mounting feature. A method for sealing electronic module conductors is provided which improves the sealing properties around the conductors positioned on the first and second side of the PCB.

Description

[0001] Cross References to Related Applications [0002] This application claims priority and the benefit of US Provisional Patent Application No. 60 / 711,433, filed August 26, 2005 (which is hereby incorporated by reference in its entirety). Background technique [0003] The present invention relates generally to automotive electronic systems. More specifically, the invention relates to electronic modules and methods for sealing components of electronic modules. [0004] Automotive electronic systems may include a large number of electronic modules. For example, crash sensors used in car safety systems, which collect information related to car crashes. Typically, a sensor includes multiple electronic components. Electronic components are typically mounted on a printed circuit board (PCB). Because of possible exposure to uncontrolled environmental conditions, the PCB and its components need to be protected. [0005] In order to protect the electronic components described a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B60R16/02H05K3/28H05K5/06
CPCB60R16/0231H01R13/52H01R13/6658H01R13/6683H05K3/284H05K5/0078H05K5/064H05K2201/09063
Inventor R·N·斯蒂勒
Owner TK HLDG
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