Unlock instant, AI-driven research and patent intelligence for your innovation.

Grain binding material and method for light emitting diode

A technology of light-emitting diodes and eutectic materials, which can be applied to electrical components, circuits, semiconductor devices, etc., and can solve problems such as heat dissipation of bonding materials and unsatisfactory manufacturing processes

Inactive Publication Date: 2008-11-19
HIGH POWER LIGHTING CORP
View PDF1 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the main purpose of the present invention is to provide an adhesive material and a die-bonding method used in the die-bonding stage in the packaging process of light-emitting diodes, so as to solve the unsatisfactory problems of the aforementioned existing bonding materials in terms of heat dissipation and manufacturing process.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Grain binding material and method for light emitting diode
  • Grain binding material and method for light emitting diode
  • Grain binding material and method for light emitting diode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The invention relates to the bonding material used in the crystal-bonding stage in the packaging process of light-emitting diodes and the crystal-bonding method.

[0029] The present invention is applicable to light-emitting diodes in all packaging structures in which the base carrying crystal grains is made of metal, such as Figure 1a ~ Figure 1d The packaging structure of the shown Chinese Taiwan invention patent application No. 94140253.

[0030] As shown in the figure, the package structure at least includes a base 100 , a reflector 110 , LED die 150 , a plurality of wires 120 , and a transparent filler 130 . The base 100 is integrally formed by a metal base 102 , a plurality of electrodes 104 , and an insulator 106 and has a flat shape. Both the heat sink 102 and the electrode 104 are made of metal materials with high conductivity and high thermal conductivity. The insulator 106 is made of resin or similar insulating material. This structure is only one of the a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a die attaching material for an LED enclosure and the method thereof. The die attaching method mainly makes use of the metal material of a baseplate for eutectic crystal bonding, including the following steps: a proper eutectic crystal adhesive material layer is coated on the upper surface of the metal pedestal of the enclosure; then crystal grains of the LED are arranged on the eutectic crystal adhesive material of the pedestal; eutectic crystal bonding is done on the finished product under appropriate temperature provided by a thermal plate, an oven or a continuous tunnel furnace. The die attaching material gets rid of the defects in the heat dissipation process and the fabrication process of current adhesive materials.

Description

technical field [0001] The invention relates to a package of light-emitting diodes, in particular to an adhesive material and a method for bonding crystals during the packaging of light-emitting diodes. Background technique [0002] Figure 1a ~ Figure 1d Shown are several major steps involved in an existing LED package. Shown in the figure is the package structure of China Taiwan Invention Patent Application No. 94140253. Wherein, the base 100 includes a base 102 , an electrode 104 , and an insulator 106 separating the electrode 104 and the base 102 , and is integrally formed. Both the base 102 and the electrode 104 are made of metal materials with high electrical conductivity and high thermal conductivity. The insulator 106 is made of resin or similar insulating material. [0003] First, if Figure 1a As shown, an appropriate layer of bonding material 108 is coated on the upper surface of the base 102 . Next, if Figure 1b As shown, the LED die 150 is fixed on the bo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/00H01L33/48H01L33/56
Inventor 杨智皓林彩雪纪孟男赵恒德
Owner HIGH POWER LIGHTING CORP