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Semiconductor package, method of producing the same, semiconductor module, and electronic apparatus

A manufacturing method and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device components, circuits, etc., and can solve problems such as the influence of module size

Inactive Publication Date: 2008-11-19
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Thus, although the demand for miniaturization of camera modules continues to increase, the area used for the positioning of the image sensor and the lens holder that supports the lens has a large impact on the module size

Method used

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  • Semiconductor package, method of producing the same, semiconductor module, and electronic apparatus
  • Semiconductor package, method of producing the same, semiconductor module, and electronic apparatus
  • Semiconductor package, method of producing the same, semiconductor module, and electronic apparatus

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0043] according to figure 1 One embodiment of the present invention is illustrated through FIG. 5 .

[0044] (1) Camera module related to the present invention

[0045] figure 1 It is a sectional view of the camera module 1 of this embodiment. The camera module 1 has a structure in which a lens member 20 is mounted on a semiconductor package 10 to integrate them.

[0046] figure 2 is a cross-sectional view of the semiconductor package 10, image 3 is a plan view of the semiconductor package 10 . The semiconductor package 10 has a structure in which an image sensor 11 is mounted on a printed wiring board (hereinafter referred to as “wiring board”) 13 .

[0047] The wiring substrate 13 is a substrate on which a wiring pattern is formed. Wire bonding terminals 13 a are provided on the surface of the wiring board 13 on which the image sensor 11 is mounted, and external connection electrodes 13 b are provided on the opposite surface (back surface). The wire bonding term...

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Abstract

A camera module (1) has a lens member (20) attached to a semiconductor package (10). The semiconductor package (10) has an image sensor (11) mounted on a wiring board (13) and a wire (15) for electrically connecting the wiring board (13) and the image sensor (11). The image sensor (11) is sealed together with the wire (15) by mold resin (14). A step (18) is formed at the perimeter edge of the surface of the mold resin (14), and the semiconductor package (10) and the lens member (20) are joined by fitting to each other the step (18) and a projection (23) of the lens holder (22). Accordingly, the semiconductor package and the mounting component joint to the package are highly precisely aligned with each other, and the semiconductor package that can be reduced in side is realized.

Description

technical field [0001] The present invention relates to a semiconductor package and its manufacturing method, a semiconductor module including the semiconductor package, and electronic equipment including the semiconductor module. Background technique [0002] In recent years, electronic cameras with imaging elements have been used in various electronic devices such as mobile phones, mobile information terminals, personal computers, and digital cameras. At present, miniaturization and cost reduction are demanded for these electronic cameras. Therefore, many electronic devices are gradually using a small camera module in which an image sensor (semiconductor chip) and a lens are integrated (single package). [0003] Thus, although the demand for miniaturization of the camera module is increasing, the area for positioning of the image sensor and the lens holder supporting the lens greatly affects the module size. [0004] For example, Patent Documents 1 to 4 disclose small ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/28H01L27/14
CPCH01L2924/01005H01L2924/01033H01L2924/01082H01L2224/97H01L2924/01047H01L2224/48091H01L2924/01015H01L2924/3025H01L2224/48227H01L2924/014H01L27/14618H01L24/97H01L2924/01006H01L2924/01078H01L27/14625H01L2924/14H01L2924/1815H01L2924/181H01L2924/00014H01L2224/85H01L2224/83H01L2924/00H01L23/28H01L27/14
Inventor 石川和弘西田胜逸藤田和弥仲桥孝博
Owner SHARP KK