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Packaging method for LED with high cooling efficiency and packaging structure thereof

A technology of light-emitting diodes and luminous effects, which is applied in the manufacture of electrical components, electric solid devices, semiconductor/solid-state devices, etc., can solve problems such as inconvenience, the inability to obtain heat dissipation effect of light-emitting diode chips D, and burnout of light-emitting diode chips D, etc., to achieve The effect of shortening the process time

Inactive Publication Date: 2008-12-03
HARVATEK CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In other words, due to the fact that the length 11 of the base S1 is too short, the known light-emitting diode chip D will not be able to obtain an effective heat dissipation effect, and then the light-emitting diode chip D will burn out due to overheating.
[0007] It can be seen from the above that the currently known packaging methods and packaging structures of light-emitting diodes obviously have inconveniences and defects, and need to be improved.

Method used

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  • Packaging method for LED with high cooling efficiency and packaging structure thereof
  • Packaging method for LED with high cooling efficiency and packaging structure thereof
  • Packaging method for LED with high cooling efficiency and packaging structure thereof

Examples

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Embodiment Construction

[0087] see Figure 4 , Figure 4 a to Figure 4 d, and Figure 1A to Figure 4 D shows. Figure 4 It is a flow chart of the first embodiment of the packaging method of the present invention, Figure 4 a to Figure 4 d are respectively the schematic diagrams of the packaging process of the first embodiment of the packaging structure of the present invention, Figure 4 A to Figure 4 D is a schematic cross-sectional view of the packaging process of the first embodiment of the packaging structure of the present invention, respectively. Depend on Figure 4 It can be seen from the flow chart that the first embodiment of the present invention provides a method for packaging a light-emitting diode with a high-efficiency lateral light-emitting effect, which includes the following steps:

[0088] First of all, please cooperate Figure 4 a and Figure 4 As shown in A, a substrate unit (substrate unit) 1 is provided, which has a substrate body (substrate body) 10, and a plurality of positiv...

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PUM

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Abstract

The invention discloses a packaging structure of a light-emitting diode with high-efficiency light-emitting effect and comprises: a substrate unit, a light-emitting unit and a packaging colloid unit, wherein, the substrate unit is provided with a substrate body, an anode conductive trace and a cathode conductive trace which are respectively formed on the substrate body. The light-emitting unit is provided with a plurality of light-emitting diode chips which are arranged on the substrate body, wherein, each light-emitting diode chip is provided with an anode end and a cathode end which are respectively electrically connected with the anode conductive trace and the cathode conductive trace of the substrate unit. The packaging colloid unit is provided with a plurality of packaging colloids which are respectively covered on the light-emitting diode chips, wherein, a colloid arc surface and a colloid light-emitting surface are respectively arranged at the upper surface and the front surface of each packaging colloid.

Description

technical field [0001] The present invention relates to a packaging method and a packaging structure of a light emitting diode, in particular to a packaging method and a packaging structure of a light emitting diode with a high-efficiency lateral light-emitting effect. Background technique [0002] Please refer to FIG. 1 , which is a flow chart of the first known packaging method for light emitting diodes. It can be seen from the flow chart that the first packaging method of light-emitting diodes is known, and the steps include: firstly, providing a plurality of packaged light-emitting diodes (packaged LEDs) (S800); then, providing a stripped substrate body ), on which there is a positive electrode trace (positive electrode trace) and a negative electrode trace (negative electrode trace) (S802); finally, each packaged light-emitting diode (packaged LED) is sequentially arranged on the strip substrate body and electrically connect the positive and negative terminals of each ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/56H01L25/075
CPCH01L24/97H01L2224/48091H01L2924/12041H01L2924/15747H01L2924/15787H01L2924/1815
Inventor 汪秉龙庄峰辉吴文逵
Owner HARVATEK CORPORATION
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