Packaging method for LED with high cooling efficiency and packaging structure thereof
A technology of light-emitting diodes and luminous effects, which is applied in the manufacture of electrical components, electric solid devices, semiconductor/solid-state devices, etc., can solve problems such as inconvenience, the inability to obtain heat dissipation effect of light-emitting diode chips D, and burnout of light-emitting diode chips D, etc., to achieve The effect of shortening the process time
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[0087] see Figure 4 , Figure 4 a to Figure 4 d, and Figure 1A to Figure 4 D shows. Figure 4 It is a flow chart of the first embodiment of the packaging method of the present invention, Figure 4 a to Figure 4 d are respectively the schematic diagrams of the packaging process of the first embodiment of the packaging structure of the present invention, Figure 4 A to Figure 4 D is a schematic cross-sectional view of the packaging process of the first embodiment of the packaging structure of the present invention, respectively. Depend on Figure 4 It can be seen from the flow chart that the first embodiment of the present invention provides a method for packaging a light-emitting diode with a high-efficiency lateral light-emitting effect, which includes the following steps:
[0088] First of all, please cooperate Figure 4 a and Figure 4 As shown in A, a substrate unit (substrate unit) 1 is provided, which has a substrate body (substrate body) 10, and a plurality of positiv...
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