Supercharge Your Innovation With Domain-Expert AI Agents!

LED chip encapsulation method and construction having high efficient lateral direction light emission effect

A chip packaging structure and light-emitting diode technology, which is applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of inconvenience, burnout of the light-emitting diode chip D, and inability to obtain heat dissipation effects, and shorten the process time. Effect

Active Publication Date: 2012-01-04
HARVATEK CORPORATION
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In other words, due to the fact that the length l1 of the base S1 is too short, the conventional LED chip D will not be able to obtain effective heat dissipation, and the LED chip D will burn out due to overheating.
[0005] Therefore, it can be seen from the above that the current packaging methods and packaging structures of light-emitting diodes obviously have inconveniences and shortcomings, and those that need to be improved

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED chip encapsulation method and construction having high efficient lateral direction light emission effect
  • LED chip encapsulation method and construction having high efficient lateral direction light emission effect
  • LED chip encapsulation method and construction having high efficient lateral direction light emission effect

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0071] see image 3 , Figure 3a to Figure 3f ,and Figure 3A to Figure 3F shown. image 3 It is a flow chart of the first embodiment of the packaging method of the present invention, Figure 3a to Figure 3d are respectively a schematic diagram of the packaging process of the first embodiment of the packaging structure of the present invention, Figure 3A to Figure 3D They are schematic cross-sectional views of the packaging process of the first embodiment of the packaging structure of the present invention. Depend on image 3 It can be seen from the flow chart that the first embodiment of the present invention provides a method for packaging a light-emitting diode chip with a high-efficiency lateral light-emitting effect, which includes the following steps:

[0072] First of all, please cooperate Figure 3a and Figure 3A As shown, a substrate unit 1 is provided, which has a substrate body (substrate body) 10, and several positive electrode traces (positive electrode t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a light-emitting diode chip packaging structure with high-efficiency lateral lighting effect. The structure comprises a base plate unit, a light-emitting unit, a package colloid unit and a frame unit, wherein, the light-emitting unit comprises a plurality of light-emitting diode chips which are electrically arranged on the base plate unit. The package colloid unit comprises a stripe package colloid covering the light-emitting diode chips, wherein, a colloid arc surface and a colloid light-exiting surface are arranged on the upper surface and the front surface of the stripe package colloid respectively. The frame unit adopts a frame layer covering the base plate unit and coating the stripe package colloid, and only the colloid light-exiting surface is exposed.

Description

technical field [0001] The present invention relates to a packaging method of a light-emitting diode chip and its packaging structure, in particular to a packaging method of a light-emitting diode chip with a high-efficiency lateral light-emitting effect (high-efficiency lateral light-emitting effect) and its packaging structure. Background technique [0002] see figure 1 As shown in FIG. 1 , it is a flow chart of an existing packaging method for light emitting diodes. It can be known from the flow chart that the steps of the existing LED packaging method include: firstly, providing several packaged LEDs (packaged LED) (S800); then, providing a stripped substrate body, on which There is a positive electrode trace (positive electrode trace) and a negative electrode trace (negative electrode trace) (S802); finally, each packaged light-emitting diode (packaged LED) is arranged on the strip substrate body in sequence, and The positive and negative terminals of each packaged LE...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L25/00H01L25/075H01L23/31
CPCH01L24/97H01L2224/48091H01L2924/12041H01L2924/15747H01L2924/1815
Inventor 汪秉龙巫世裕吴文逵
Owner HARVATEK CORPORATION
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com