Rack-mounted case contact heat dissipation module

Abstract

The invention discloses a rack-mounted case contact heat dissipation module, and particularly relates to the field of computer heat dissipation, the rack-mounted case contact heat dissipation module comprises a case body, the case body is provided with a heat conduction shoe, the rack-mounted case contact heat dissipation module is made of a high-heat-conductivity material and is installed on a side plate of a case, and a heat dissipation connector faces the outside of the case; high-power heating components such as a CPU and a GPU in the case bodies are connected with the heat absorption fins through heat pipes, heat generated by other components is absorbed by the heat absorption fins through which air circulation in the case bodies passes, and when the case bodies are stacked on a rack, the heat dissipation connectors on the side faces of the case bodies are located in the same vertical space, so that the heat dissipation efficiency of the case bodies is improved. The vertical cold source pipeline is arranged on the side face of the machine frame, after the machine box body is horizontally inserted into the upper frame from the front portion of the machine frame, the heat dissipation connector is connected with the heat conduction shoe, efficient heat dissipation of electronic equipment can be achieved, and an efficient heat conduction channel independent of air exchange can be established between main high-power heating components in the machine box and a cold source outside the machine box through the design.

Description

technical field [0001] The invention relates to the field of computer heat dissipation, in particular to a rack-type chassis contact heat dissipation module. Background technique [0002] At present, with the rise of cloud computing, data centers of various scales have been built one after another. Because of the large number of devices and the high heat generation, the problem of heat dissipation has always plagued data center builders and operators. [0003] The network equipment chassis of the data center is basically a standard 19-inch rack-type structure, and these rack-type electronic equipment have high distribution density and high heat generation. The air inside and outside the chassis is exchanged for heat dissipation. In order to ensure the normal operation of the equipment, each data center basically adopts the method of first cooling the air, and then introducing the cold air into the electronic equipment chassis through the cabinet to dissipate the heat of the ...

AI Technical Summary

Problems solved by technology

As we all know, the specific heat capacity of air is small, and the heat transfer efficiency is low. Air exchange is used as the intermediate medium for heat dissipation. When the power of the equipment is large, it is necessary to use a "cold source" with a lower temperature and a larger air flow rate.

At this time, not only the energy consumption of the fan is high and the noise is loud, but the dust in the airflow can also easily cause the fan and heat sink to be blocked by dust, and the condensation of the low-temperature "cold source" surface cooler also increases the energy consumption, which makes the entire system consume more energy. , the failure rate is high; and the heat dissipation method of soaking the circuit board in the insulating and heat-conducting liquid is still in the experimental stage due to complicated technology, high cost, and polluting the environment. Cooling module

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