Packaging method for LED with high cooling efficiency and packaging structure thereof

Abstract

The invention discloses a packaging structure of a light-emitting diode with high-efficiency light-emitting effect and comprises: a substrate unit, a light-emitting unit and a packaging colloid unit, wherein, the substrate unit is provided with a substrate body, an anode conductive trace and a cathode conductive trace which are respectively formed on the substrate body. The light-emitting unit isprovided with a plurality of light-emitting diode chips which are arranged on the substrate body, wherein, each light-emitting diode chip is provided with an anode end and a cathode end which are respectively electrically connected with the anode conductive trace and the cathode conductive trace of the substrate unit. The packaging colloid unit is provided with a plurality of packaging colloids which are respectively covered on the light-emitting diode chips, wherein, a colloid arc surface and a colloid light-emitting surface are respectively arranged at the upper surface and the front surface of each packaging colloid.

Description

technical field [0001] The present invention relates to a packaging method and a packaging structure of a light emitting diode, in particular to a packaging method and a packaging structure of a light emitting diode with a high-efficiency lateral light-emitting effect. Background technique [0002] see figure 1 Shown is a flow chart of the first known packaging method for light emitting diodes. It can be seen from the flow chart that the first packaging method of light-emitting diodes is known, and the steps include: firstly, providing a plurality of packaged light-emitting diodes (packaged LEDs) (S800); then, providing a stripped substrate body ), on which there is a positive electrode trace (positive electrode trace) and a negative electrode trace (negative electrode trace) (S802); finally, each packaged light-emitting diode (packaged LED) is sequentially arranged on the strip substrate body and electrically connect the positive and negative terminals of each packaged LE...

AI Technical Summary

Problems solved by technology

In other words, due to the fact that the length l1 of the base S1 is too short, the known light-emitting diode chip D will not be able to obtain an effective heat dissipation effect, and then the light-emitting diode chip D will burn out due to overheating.

[0007] It can be seen from the above that the currently known packaging methods and packaging structures of light-emitting diodes obviously have inconveniences and defects, and need to be improved.

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