Semiconductor refrigerator
A refrigeration device and semiconductor technology, applied in refrigerators, refrigeration and liquefaction, and machines using electromagnetic/magnetic effects, etc., can solve problems such as power consumption, material waste, environmental pollution, etc., and achieve the effect of improving the refrigeration effect.
Inactive Publication Date: 2009-01-07
姚逸知
View PDF0 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] Most of the current air conditioners are split-type and use external units, compressors, and refrigerants. This type of air conditioner wastes materials, pollutes the environment, and consumes electricity.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0015] The invention is a semiconductor refrigeration device, the main structure of which includes 1 low-temperature radiator, 2 cooling sheets, 3 cooling folding sheets, 4 semiconductor refrigeration sheets, 5 high-temperature radiators, 6 cooling fans, 7 heat preservation boxes, and 8 cooling air ducts , 9 cooling fans. Install a low-temperature radiator at both ends of the closely arranged cooling sheets and cooling flaps, install an insulation box on the low-temperature radiator, install a semiconductor refrigeration sheet, a high-temperature radiator, and a cooling fan on the back of the low-temperature radiator, and then install a cooling air duct and a cooling fan .
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a semiconductor refrigeration device, comprising a low-temperature emitter 1, a cooling fin 2, a cooling bending fin 3, a semiconductor refrigerating fin 4, a high-temperature emitter 5, a cooling fan 6, a heat preserving box 7, a colling wind channel 8 and a cooling blower 9. The semiconductor refrigeration device adopts a symmetrical design on both sides; the low-temperature emitter is arranged at both sides of the cooling fin and the cooling bending fin which are arranged very closely to each other so as to ensure that both the cooling fin and the cooling bending fin can cool air. Through a plurality of combinations, the semiconductor refrigeration device can serve as a wall air conditioner, a vertical air conditioner, a ceiling concealed air conditioner and a dual-purpose air conditioner for a vehicle and a vessel. Therefore, the invention can be used as an air conditioner characterized by saving electricity, saving materials and protecting environment, without an outdoors machine, a compressor and refrigerating liquid.
Description
technology field; [0001] The invention relates to a semiconductor refrigeration device, in particular to the improvement of air conditioner technology. Background technique; [0002] Most of the current air conditioners are split-type and use external units, compressors, and refrigerants. This type of air conditioner wastes materials, pollutes the environment, and consumes electric energy. content of the invention; [0003] The object of the present invention is to provide a semiconductor refrigerating device, which can be used to manufacture an environment-friendly air conditioner without an external machine, no compressor, no refrigerant liquid, and can save electricity and materials. [0004] The object of the present invention is achieved in that when the semiconducting refrigerating sheet (4) works, the low temperature is transmitted to the low temperature radiator (1) on one side, and the low temperature radiator is cooled and then the low temperature is transmitted ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/02
Inventor 姚逸知
Owner 姚逸知

