Photomask detection method and on-line immediate photomask detection method
What is AI technical title?
AI technical title is built by PatSnap AI team. It summarizes the technical point description of the patent document.
A detection method and photomask technology, applied in the field of photomask detection, can solve problems such as time spent, cost increase, and low sampling rate
What is AI technical title?
AI technical title is built by PatSnap AI team. It summarizes the technical point description of the patent document.
A detection method and photomask technology, applied in the field of photomask detection, can solve problems such as time spent, cost increase, and low sampling rate
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0041] In the photolithography process, the exposure process will cause photomask shadows on the photomask, and the photomask shadows will gradually expand with the increase of process time, which will not only affect the subsequent process, but also affect the reliability of the process And the cost of many processes. Therefore, when performing the photolithography process, the present invention also considers the influence of the shadow of the photomask on the pattern transfer, compares the wafers that have completed the process steps, and effectively detects whether the shadow of the photomask is formed on the photomask. The implementation of the online real-time photomask inspection method of the present invention will be described below in the form of a flow chart.
[0042] Figure 1A It is a schematic diagram of a photolithography process according to an embodiment of the present invention. Figure 1B It is a schematic top view of a wafer according to an embodiment of t...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
PUM
Login to View More
Abstract
The invention discloses a photomask detecting method which is applicable to the photomasks provided with a pattern zone and a blank zone. Firstly, a chip for carrying out lithography in virtue of the photomask is provided. The chip is provided with a plurality of exposure zones and each exposure zone is provided with a component pattern zone, wherein, each component pattern zone is surrounded by a cutting channel zone and corresponds to the photomask pattern zone and the cutting channel zone corresponds to the photomask blank zone. Secondly, the cutting channel zone is divided into a plurality of virtual pattern zones. Then a step of two-two overlapping comparison is carried out for the virtual pattern zones, and when at least one of the virtual pattern zones dose not fully overlap with other virtual pattern zones, a photomask shadow appears on parts of the blank zone of the photomask corresponding to the virtual pattern zone without full overlapping.
Description
technical field [0001] The invention relates to a photomask detection method, and in particular to an online real-time photomask detection method. Background technique [0002] Recently, semiconductors tend to shrink the design and development of circuit elements, and one of the most important steps in the whole semiconductor process is photolithography. Anything related to the semiconductor device structure, such as the pattern of each layer of thin film, is determined by the photolithography process to determine the size of its critical dimension (CD). Therefore, the accuracy of transferring the pattern on the photomask to the wafer (wafer) plays a very important role. If the pattern on the photomask is incorrect, the transfer of the pattern will be even more incorrect, thereby affecting the tolerance of critical dimensions on the wafer and reducing the resolution of exposure. [0003] When making a photomask, sulfuric acid is usually used to clean the photomask, so that...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine