A method for protecting the mirror area of ​​a cob mirror aluminum substrate

Abstract

The invention discloses a mirror surface region protection method of a COB mirror surface aluminum base plate, which comprises the following steps: step 1, preparing heat resistant glue: respectively weighing the following components in parts by weight: 60-65 parts of VAGH, 18-22 parts of curing agent, 8-10 parts of phthalate, 2-5 parts of lubricant and 2.5-5 parts of pigment system; heating the VAGH, curing agent and phthalate to 55-65 DEG C, stirring uniformly, then adding the lubricant and the pigment system, after fully stirring and cooling to room temperature to obtain the heat resistant glue; step 2, screen printing: by enabling a prepared screen to correspond to a mirror surface region of the COB mirror surface aluminum base plate, printing the heat resistant glue, and baking; step 3, reflow soldering: performing hot air reflow soldering on the COB mirror surface aluminum base plate; step 4, film tearing: after the reflow soldering is finished, manually tearing a protection film. By performing screen printing of the heat resistant glue in the mirror surface region, during reflow soldering, the mirror surface region is effectively protected.

Description

technical field [0001] The invention relates to the technical field of COB packaging, in particular to a method for protecting a mirror area of ​​a COB mirror aluminum substrate. Background technique [0002] COB light source is a high-efficiency integrated surface light source technology in which LED chips are directly attached to a high-reflectivity mirror metal substrate. Due to process requirements, the COB aluminum substrate needs to pass through a reflow oven to prevent the mirror area and the bonding pad from being polluted or oxidation, the area needs to be covered for protection purposes. [0003] In the existing technology, the traditional protection method is to make the bottom plate of the jig or manually apply the glue. This method requires manual picking and placing of the substrate and manual glue application, which is inefficient and error-prone, and the temperature of the substrate will be brought by the jig. Unevenness will cause warping and peeling, and t...

AI Technical Summary

Problems solved by technology

[0003] In the existing technology, the traditional protection method is to make the bottom plate of the jig or manually apply the glue. This method requires manual picking and placing of the substrate and manual glue application, which is inefficient and error-prone, and the temperature of the substrate will be brought by the jig. Unevenness, causing warping and peeling, the heat-resistant glue that is manually pasted may remain, and it will also pollute the protected area and fail to protect

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