Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Socket adaptor apparatus

A technology of adapters and sockets, which is applied to the structural parts of electrical equipment, instruments, and parts of electrical measuring instruments, etc. It can solve the problems of complex contact shapes of sockets, difficulty in disengaging sockets, and high cost of sockets.

Inactive Publication Date: 2009-01-14
SENSATA TECHNOLOGIES INC
View PDF1 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this mounting, as described above, the contacts of the socket and the circuit board are directly soldered, with the result that it becomes difficult to disengage the socket
[0006] Although it is conceivable to replace the contacts of the socket with probes, the shape of the contacts of the socket is complicated, and if it is used, the cost of the socket becomes extremely high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Socket adaptor apparatus
  • Socket adaptor apparatus
  • Socket adaptor apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The above and other objects and features of the present invention will become apparent from the detailed description of the invention together with the accompanying drawings and appended claims.

[0029] figure 1 shows an example of a socket to which a socket adapter made according to the first preferred embodiment of the present invention has been connected. The socket adapter 10 is to be connected between the circuit substrate and the socket 20, thereby providing an electrical interface between the socket and the circuit substrate. It is possible to mount various packages on the socket 20 such as BGA, LGA, PLCC, and the like. socket 20 as figure 1 As shown in , it includes a cover member 40 capable of reciprocating movement toward and away from the base member 30 , and a plurality of elongated contact members 50 that have been installed in the base member 30 .

[0030] A pair of coil springs (not shown in the drawings) are interposed between the cover member 40 a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A socket adaptor 10 made of an electrically insulating material has a main adaptor body 12 on which a plurality of through holes 14 containing an upper opening and a lower opening has been formed. In certain preferred embodiments a probe pin 60 and coil spring 62 is placed in each through holes 14. An electrical engagement clipping part 68 for clipping a contact inserted in a respective through hole from said upper opening is formed on the upper end of each probe pin 60. The coil spring 62 is installed on each probe pin and biases the respective probe pin toward a position so that a tip formed on the lower end of the probe pin protrudes from the lower opening.

Description

technical field [0001] The present invention generally relates to an adapter for a socket for mounting a semiconductor device, and more particularly, to a socket adapter providing an interface for electrical connection between contacts of the socket and electrodes of a circuit substrate. Background technique [0002] For example, a conventional socket for a BGA package is disclosed in Japanese Patent No. 3737078 issued on November 4, 2005. This patent indicates a socket capable of mounting and detaching an electronic device including a surface mount type semiconductor device such as BGA or CSP. [0003] According to the patent, a socket comprises a base part, a cover part, a plurality of contacts, an adapter capable of moving in a direction towards or away from the base part and supplying a mounting surface for a BGA, rotatably mounted on the base part The latch part on the top, and the positioning mechanism associated with the movement of the cover part. [0004] In addit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01R12/22H01R33/76H01R12/32H01R13/11H01R13/42H01R12/71H01R12/55
CPCH05K7/1084H01R13/112H01R12/57H01R13/111H01R13/2421G01R1/0483H01R33/76
Inventor 高桥秀幸池谷清和
Owner SENSATA TECHNOLOGIES INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com