Apparatus and method for separating and transporting substrates

A technology of substrates and fluidic devices, applied in the field of substrates provided in the form, can solve problems such as damage to substrates to be separated, occurrence of tolerances, and movement of substrate positions

Inactive Publication Date: 2011-11-09
RENA有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is very difficult to achieve this, because on the one hand the relative movement of the holding device is provided in order to position the substrate to be separated in the region of the holding device, and the holding device itself thus has a corresponding degrees of freedom
There is thus the possibility of tolerances which may result in damage to the substrates to be separated
On the other hand, such movements usually take place in a fluid, so there is the risk that a single movement of the device, in particular in the direction of the substrate, will generate a flow pressure which can lead to a shift in the position of the substrate or even cause it to break
[0031] Manual separation involves the risk that the very thin and easily broken disc-shaped substrates will shatter, especially due to the increased adhesion.

Method used

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  • Apparatus and method for separating and transporting substrates
  • Apparatus and method for separating and transporting substrates
  • Apparatus and method for separating and transporting substrates

Examples

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Embodiment Construction

[0085] Schematic in Figure 1 Figures 1A-1F The central concept of the device 101 according to the invention and the method according to the invention is shown schematically. The device 101 is suitable for separating and transporting substrates 102 configured as disks.

[0086]In the exemplary embodiment shown, the substrates 102 are arranged in a substrate stack 103 , wherein the substrate stack 103 is supported in a support arrangement 104 . The individual substrates 102 have been released from the holding means. Preferably, the plane perpendicular to the surface of the single substrate 102 pointing in the feed direction is at an angle α (tilt angle) with respect to the feed direction (in figure 2 shown in ) arrangement. When the arrangement is arranged inside a fluid, this tilted position prevents the individual substrates 102 from floating or accidentally leaving the support arrangement 104 when the substrate stack 103 is erected. In addition, the individual substrate...

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Abstract

The invention particularly relates to separating and transporting a disk-shaped substrate (102; 202), such as a solar wafer. The invention is characterized in that separation steps are performed within a fluid and that adhesive forces develop between a gripper (108; 208) and the substrate to be separated (102; 202) due to a thin fluid film, the forces enabling adhesion to the gripper (108; 208). Due to the removal transversely to the feed direction (105; 205) or particularly parallel to a flat extension of the substrates (102; 202), a very gentle and efficient separation of disk-shaped substrates (102; 202) at a high cycle time is achieved.

Description

technical field [0001] The invention relates to a device for separating and transporting substrates. The substrate is configured as a disc and is easily broken. For separating the substrates, a holder device is provided which receives the individual substrates in the form of a substrate stack and prepares them for separation. The take-out device performs the process of separation and delivery. [0002] Furthermore, the invention relates to a method for separating and transporting substrates provided in the form of a substrate stack. Background technique [0003] said "substrate" The configuration is disk-shaped or planar and generally rectangular. They are obtained from substrate blocks after a sawing process. They have circumferential, substantially straight edges, wherein the corners can be square, rounded or chamfered. [0004] Multiple substrates stacked one on top of the other or side by side or one behind the other produce a "Substrate stack" . If the substrat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/00
CPCB28D5/0088B28D5/0082H01L21/67092H01L21/67126H01L21/6776
Inventor R·赫特K·卡尔滕巴克
Owner RENA有限责任公司
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