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Wafer transmission sheet

A technology for transferring sheets and wafers, applied in the direction of conveyor objects, transportation and packaging, etc., can solve problems such as deterioration and wafer damage

Active Publication Date: 2011-09-28
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the wafer damage issues discussed above are exacerbated when the transfer rate increases

Method used

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  • Wafer transmission sheet
  • Wafer transmission sheet
  • Wafer transmission sheet

Examples

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Embodiment Construction

[0015] In the following detailed description of the preferred embodiments, reference may be made to accompanying drawings in part, which are shown by way of illustration of specific embodiments of the invention practiced. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the present invention.

[0016] refer to figure 1 and 2 , which discloses a wafer transfer sheet 100 used in a wafer transfer automatic control device. figure 1 It is a top view of the wafer transfer sheet 100 , which has the outline of the semiconductor wafer 50 held by the wafer transfer sheet 100 (shown with superimposed dotted lines). The wafer transfer sheet 100 includes a base 10 for supporting a wafer 50 that extends in length longer than the diameter of the wafer and has a front end 12 and a rear portion 40 . The rear portion 40 of the wafer transfer sheet 100 is framed for attachment to the transfer robot.

[0017] ...

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Abstract

A wafer transfer piece for wafer conveying automatic control device, has a pocket space with an improved structure, so as to minimize the breakage of wafer in the pick-up and conveying of the wafer conveying automatic control device. The transfer piece has a slope below the transfer piece, to allow inaccurate wafer to slide along the slope, with no harm to the surface of the wafer.

Description

technical field [0001] The invention relates to a semiconductor wafer, in particular to the semiconductor wafer transportation technology. Background technique [0002] In many processes of semiconductor wafer manufacturing, the stacked wafers held in the wafer cassette are individually picked up by the transfer automatic control device, and transferred to one or more processing stations / chambers, and then returned to the wafer carrier. The transfer robot uses a wafer transfer sheet that slides under the wafer in the cassette, lifts the wafer, moves to a special processing station / chamber and unloads the wafer. In the case where the transfer robot is only able to move in the X-Y plane, the cassette will move down to keep the wafers on the wafer transfer sheet. [0003] Such wafer transfer sheets typically have a pocket to hold the wafer during transport. The pocket is a stepped depression formed on the top surface of the transfer sheet. Because of the tolerances of the ca...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677
Inventor 郑翔升谢子逸阙嘉良陈俊仁纪元兴黎伟钦
Owner TAIWAN SEMICON MFG CO LTD