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Processing device

A technology for cutting devices and wafers, which is applied in closed-circuit television systems, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the problems of not being able to clearly identify which part, not being able to find out the cause, and not being able to visually confirm the area due to calibration errors, etc. Achieving rapid and correct cause identification

Active Publication Date: 2011-09-14
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] According to the calibration device disclosed in Patent Document 1, the time required for calibration can be shortened, but there is a problem that it is not possible to visually confirm whether calibration is performed in an appropriate area, or it is impossible to visually confirm that an error occurs when a calibration error occurs. area
[0010] In addition, in the automatic cutting system disclosed in Patent Document 2, although the operator can roughly recognize the area captured by the imaging means, there is a problem that, when an inappropriate cutting groove is detected, it cannot be clearly recognized. Which part of the wafer does the area correspond to, the cause cannot be quickly found out, etc.

Method used

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Embodiment Construction

[0021] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. figure 1 It shows the appearance of a cutting device (dicing device) 2 capable of cutting a wafer and dividing it into individual chips (devices).

[0022] On the front surface side of the cutting device 2, an operation member 4 for allowing an operator to input instructions to the device such as machining conditions is provided. On the upper part of the apparatus, a display means (monitor) 6 such as a CRT is installed, and the display means 6 displays a guidance screen for an operator and an image captured by an imaging means described below.

[0023] Such as figure 2 As shown, on the surface of the wafer W as the cutting target, the first and second partitions S1 and S2 are formed orthogonally, and the wafer is formed on the wafer W divided by the first and second partitions S1 and S2. Multiple devices coming from D.

[0024] The wafer W is attached to a d...

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PUM

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Abstract

The invention provides a processing device, capable of definitely identifying the region and quickly and exactly identifying causes when there is unfavorable condition in an image displayed in a monitor, comprising: a chuck table holding a workpiece; a processing component which processes a workpiece held at this chuck table; an image pick-up component which picks up images of a workpiece; and a display component which displays an image picked by the imaging component, characterized in that the image pick-up component comprises: a whole image pick-up part which picks up images of the whole workpiece held at the chuck table; a details image pick-up part which picks up images of details of a workpiece; and an image synthesis part which displays a position of a details picture on a whole image of a workpiece while synthesizing and displaying images of the whole workpiece picked up by the whole image pick-up part and images of details picked up by the details image pick-up part on the display component.

Description

technical field [0001] The present invention relates to a processing device having a calibration area or a processing area that can be visually confirmed. Background technique [0002] Regarding semiconductor wafers, a large number of devices such as IC (Integrated Circuit: Integrated Circuit) and LSI (Large Scale Integration: Large Scale Integration) are formed on the surface, and each device is divided by a predetermined division line (spacer). , after grinding the back surface to a predetermined thickness by a grinding device, cutting the predetermined dividing line by a cutting device (cutting device) and dividing it into devices one by one, and is used in electrical equipment such as mobile phones and personal computers . [0003] The dicing device includes: a chuck table holding a semiconductor wafer; a cutting member for cutting the wafer held on the chuck table; an imaging member for imaging the wafer; and a display member for displaying an image captured by the ima...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/78H04N7/18H01L21/301H01L21/304
Inventor 关家一马
Owner DISCO CORP