Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Silicon chip kit platform having pitching function

A silicon chip box and functional technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of complex structure, easy to jitter, etc., and achieve the effect of simple and reasonable structure

Active Publication Date: 2009-03-11
陈百捷 +1
View PDF0 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the structure of the current silicon wafer box platform with pitch function is complex, and it is prone to vibration when the pitch state changes, and then drives the silicon wafer to vibrate together. This phenomenon is unacceptable to users.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Silicon chip kit platform having pitching function
  • Silicon chip kit platform having pitching function
  • Silicon chip kit platform having pitching function

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0016] As shown in Figures 1-3, the present invention includes two positioning shafts 1, one end of the two positioning shafts 1 is used for positioning connection with other devices, and the two positioning shafts 1 can be of the same length or different in length. A shield frame 2 is fixedly connected to the two positioning shafts 1, and a rotating shaft 3 is connected to the top of the shield frame 2 through a bearing, and the rotating shaft 3 is arranged parallel to the two positioning shafts 1 in space. The rotating shaft 3 is connected to the bottom front end of a turning plate 5 through a connecting block 4 fixed thereon, and the top of the turning plate 5 is fixedly connected to a standard silicon wafer box 6 . A supporting spring 7 is arranged on the side of the connecting block 4 , and the other end of the supporting spring 7 is fixedly conn...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a silicon chip box platform with pitching function, which comprises two positioning shafts, a protecting plate frame is connected to the two positioning shafts, the protecting plate frame is connected with the front end of the bottom of a turning plate by a rotating shaft mechanism, a fixing plate is connected to the two positioning shafts which are arranged in the protecting plate frame, a crank connecting rod mechanism which is connected with a driving device is connected to the fixing plate, the output end of the crank connecting rod mechanism is connected with the rear end of the bottom of the turning plate through a rotating block, and the top of the turning plate is connected with a silicon chip box. When a crank of the crank connecting rod mechanism swings in a reciprocating and intermittent mode at the range of 0 to 180 degrees, the silicon chip box is connected with the crank to swing in a pitching mode. The crank connecting rod mechanism is used as a core mechanism of the invention and the rotating shaft mechanism has simple and reasonable structure, not only can realize automatic pitching, but also can realize stable pitching, and the invention solves the problems in the prior art.

Description

technical field [0001] The invention relates to a support platform, in particular to a silicon wafer box platform with pitching function. Background technique [0002] The silicon wafers currently used in semiconductor manufacturing process equipment must be placed in a special silicon wafer box, each silicon wafer box can hold 25 silicon wafers (international standard), and the silicon wafer box is placed on the platform of the process equipment , the silicon wafers are picked and placed from the silicon wafer box on the platform by a special manipulator. At present, there are fixed silicon wafer box platform and silicon wafer box platform with pitching function that are widely used in the world. The silicon wafer box platform with pitching function has only appeared in recent years. It has the following advantages: 1. The silicon wafer box platform can be placed at a certain elevation angle. When the operator takes and places the silicon wafer box, it is relatively stable...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
Inventor 陈百捷徐伟新姚广军
Owner 陈百捷
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products