Heat radiating assembly
A technology for heat dissipation components and heating elements, which is applied in the direction of electrical components, electric solid state devices, semiconductor devices, etc., and can solve problems affecting the operating temperature of the second chip 220, etc.
Inactive Publication Date: 2009-03-11
INVENTEC CORP
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Problems solved by technology
Therefore, when using a whole piece of copper plate with better heat conduction efficiency as the heat conduction sheet 110, the temperature of the first chip 210 is easily transmitted directly to the second chip 220 through the heat conduction sheet 110, thereby affecting the operating temperature of the second chip 220.
Method used
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[0024] FIG. 2 is a schematic top view of a heat dissipation component assembled on a circuit board according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view along line I-I of FIG. 2 . Please refer to FIG. 2 and FIG. 3 , in this embodiment, the circuit board 300 is, for example, a motherboard of a notebook PC (notebook PC), and has a first heating element 310 and a second heating element 320 . Wherein, the first heating element 310 is, for example, a central processing unit, and the second heating element 320 is, for example, a graphics and memory controller hub, and the heating power of the first heating element 310 is greater than that of the second heating element 320 . But in other embodiments, the second heating element 320 can also be an image graphics array chip (video graphic array chip, VGAchip), digital signal processor (digital signal processor, DSP), north bridge chip (northbridge chip), south bridge chip (south bridge chip) or other ...
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The invention discloses a radiating component which is suitable to be assembled with a circuit board; the circuit board is provided with a first heating element and a second heating element; the heating power of the first heating element is higher than that of the second heating element; the radiating component comprises a heat-conducting connecting component, a cooling device, a first heat-conducting fin and a second het-conduction fin, wherein the heat-conducting connecting component is provided with a first part and a second part, the cooling device is connected with the first part, the first heat-conducting fin is arranged between the first heating element and the second part, and the heat-conducting fin is provided with a third part and a fourth part; the second part is connected between the first heat-conducting fin and the third part, and the fourth part is connected with the second heating element; and the heat conductivity coefficient of the first heat-conducting fin is higher than that of the second het-conduction fin.
Description
technical field [0001] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module for dissipating heat from a plurality of heat-generating elements on a circuit board. Background technique [0002] FIG. 1 is a schematic top view of a conventional heat dissipation component assembled on a circuit board. Please refer to FIG. 1 , the cooling assembly 100 is disposed on a circuit board 200 and includes a heat-transferring plate 110 , a heat pipe 120 , a fin assembly 130 and a fan 140 . A first portion 112 of the heat conduction sheet 110 is configured to contact a first chip 210 of the circuit board 200 , and a second portion 114 of the heat conduction sheet 110 is configured to contact a second chip 220 of the circuit board 200 . Wherein, the first chip 210 is, for example, a central processing unit (CPU), and the second chip 220 is, for example, a graphics and memory controller hub (GMCH). [0003] The heat pipe 120 is con...
Claims
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IPC IPC(8): H05K7/20H01L23/36H01L23/427
Inventor 王锋谷杨智凯柯皇成郑羽志周正商
Owner INVENTEC CORP