Position adjusting method for laser beam emitting device

Abstract

Intended is to provide a position adjusting method, which can simplify the positioning of a laser beam, thereby to adjust the focal point or the like of the laser beam with higher precision and for a short time period. The position adjusting method executes the step of setting an adjusting substrate (Wadj) having a slit (500) of a predetermined width formed toward the center from a circumferential edge portion, on a mounting bed so that a laser beam from a laser beam emitting device (100) may pass through the slit, the step of irradiating the receiving face of an optical energy measuring device (300) arranged on the surface side of the adjusting substrate, with the laser beam through the slit from the back side of the adjusting substrate, and the step of measuring the change in the energy quantity of the laser beam irradiating the light receiving face of the optical energy measuring device, by the optical energy measuring device, while the laser beam emitting device is being moved in the optical axis direction, thereby to adjust the position of the laser beam emitting device in the optical axis direction to a desired position on the basis of the change in the energy quantity on the light receiving face.

Description

technical field [0001] The present invention relates to a position adjustment method of a laser emitting device for irradiating laser light on a substrate to be processed placed on a mounting table. Background technique [0002] In a series of processes for manufacturing semiconductor devices, sometimes lasers are used to process substrates such as semiconductor wafers (hereinafter also simply referred to as "wafers") and glass substrates for liquid crystal displays. For processes that require higher energy locally, it is especially suitable to use lasers. For example, Patent Document 1 below describes a technique for forming a dicing line by scanning a laser beam along a substrate surface. In addition, Patent Document 2 below discloses a technique of removing a protective film on the mark with a laser beam in order to expose an alignment mark formed in advance on the substrate before exposing the substrate to light. In addition, the following Patent Document 3 describes a...

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Problems solved by technology

[0011] However, when the laser absorber is made of a metal plate such as iron, it is easily affected by the ambient temperature, so it is difficult to accurately detect changes in light energy intensity

Therefore, such a laser absorber is not suitable for laser focusing that requires higher precision than detecting whether an optical fiber is connected or not.

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