Processing method of brittle material substrate

A technology of brittle material substrates and processing methods, applied in stone processing equipment, metal processing equipment, fine working devices, etc., can solve problems such as insufficient crack position control
CN101396771AInactive Publication Date: 2009-04-01MITSUBOSHI DIAMOND IND CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
MITSUBOSHI DIAMOND IND CO LTD
Publication Date
2009-04-01
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The present invention provides a method for processing substrate made of brittle material. A crackle which penetrates into the inner part of substrate can be reliably formed at the correct position along a preset dividing line. The method for processing substrate made of brittle material uses a heating step and a cooling step for forming the crackle. The heating is executed with a mode that the beam spot (BS) moves relatively along the preset dividing line (P) according to the heating step. The cooling is executed with a mode that the cooling spot moves relatively along the track for scanningthe beam spots according to the cooling step. The cooling step comprises the following procedures executed sequentially: (a) a first cooling procedure for relatively moving the first cooling spot (CS1) which is reduced to smaller than the width of beam spots along with the beam spot thereby extending the shallow crackle (S2); and (b) a second cooling procedure for relatively moving the second cooling spot (CS2) which is extended to larger than the width of the beam spot along with the track for scanning the first cooling point, thereby penetrating the shallow crackle formed beforehand in the thickness direction of substrate.
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Description

technical field

[0001] The present invention relates to a processing method of a brittle material substrate that forms cracks by thermal stress (tensile stress) generated on the substrate by locally heating the brittle material substrate with a laser beam and then cooling the heated portion.

[0002] Here, the brittle material substrate refers to glass substrates, ceramics of sintered materials, single crystal silicon, semiconductor chips, sapphire substrates, ceramic substrates, and the like.

[0003] In addition, the "crack" is a scribe line when the front end in the depth direction does not reach the back surface of the substrate, and becomes a cutting line (full cut line) after reaching the back surface of the substrate. The scribe line is divided by performing a breaking process that applies a bending moment along the scribe line, or by applying a post-process that further infiltrates the crack into the depth of the substrate.

[0004] In addition, in the following descr...

Claims

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