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Circuit device, circuit module and outdoor unit

A technology of circuit devices and circuit modules, which is applied in the direction of circuits, electrical components, electric solid devices, etc., and can solve problems such as wrong actions

Inactive Publication Date: 2011-03-23
SANYO ELECTRIC CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, microcomputers heated by power transistors may have problems with erroneous operation

Method used

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  • Circuit device, circuit module and outdoor unit
  • Circuit device, circuit module and outdoor unit
  • Circuit device, circuit module and outdoor unit

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment

[0077] The following reference figure 1 The configuration of the hybrid integrated circuit device 10 as an embodiment of the circuit device will be described. figure 1 (A) is a perspective view of the hybrid integrated circuit device 10, figure 1 (B) is figure 1 (A) A sectional view taken along the line B-B'.

[0078] reference figure 1 (A) and figure 1 (B) In the hybrid integrated circuit device 10, the first circuit board 18 and the second circuit board 20 are overlapped and assembled on the cover material 12. A first circuit element 22 (for example, a power transistor) is arranged on the upper surface of the first circuit board 18, and a second circuit element (for example, a microcomputer) is arranged on the upper surface of the second circuit board 20. Furthermore, a hollow portion 26 (internal space) not filled with sealing resin is provided inside the outer cover material 12, and the hollow portion 26 and the outside are configured to pass through a communication port...

no. 2 Embodiment

[0129] The following reference Image 6 and Figure 7 The second embodiment will be described. The basic content of this embodiment is the same as that of the above-mentioned first embodiment, with the difference being the structure of the opening 19 that communicates the inside and outside of the device.

[0130] reference Image 6 Next, the configuration of the hybrid integrated circuit device 10 of this embodiment will be described. Image 6 (A) is a perspective view showing the hybrid integrated circuit device 10, Image 6 (B) is Image 6 (A) A sectional view taken along the line B-B'.

[0131] reference Image 6 (A) At the corners of the outer cover 12, four openings 19 for communicating the hollow portion 26 of the outer cover 12 with the outside are provided. The opening 19 has a square shape in plan view, and is formed by protruding the side wall of the outer cover material 12 to the outside.

[0132] By ventilating the air in the hollow portion 26 of the outer cover 12 thro...

no. 3 Embodiment

[0143] reference Figure 8 to Figure 13 , Describe the structure of the circuit module of this embodiment.

[0144] reference Picture 8 (A) In this embodiment, two metal substrates are used. The lower metal substrate 201B is a base substrate, and is formed so that the entire circumference of the upper metal substrate 201A is larger by L2. This distance L2 is called the extension surface distance, and is used to improve the withstand voltage characteristics between the first substrate 201A and the back surface of the base substrate 201B when the circuit module is actually constructed.

[0145] First, the outer cover 203 will be described. In addition, the cover material 203 is in the shape of a square column with the center removed. That is, there are four side walls, and the four side walls of 203A, 203B, and 203C and 203D on the left and right sides are formed integrally with respect to the paper surface. Therefore, there are openings 220 and 221 below and above. In addition,...

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PUM

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Abstract

Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device (10), a first circuit board (18) and a second circuit board (20) are incorporated into a case member (12) being arranged in a way that the first circuit board is overlaid with the second circuit board. Afirst circuit element (22) is arranged on the upper face of the first circuit board and a second circuit element (24) is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (26) (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening (15A),which is provided by partially opening the case member.

Description

Technical field [0001] The present invention relates to a circuit device, a circuit module and an outdoor unit, and more particularly to a circuit device, a circuit module and an outdoor unit in which a hybrid integrated circuit formed on a circuit board is sealed by a case material. Background technique [0002] In recent years, there have been many reports on the precursors of environmental destruction and global warming, as well as various information on the causes of this warming in newspapers. Although there are many factors for this reason, one of them is the increase in power consumption. The generation of this electricity still relies on oil that is gradually depleted, and there is a problem that carbon dioxide gas caused by the burning of this oil is released into the atmosphere. In addition, most cars are still gasoline cars, which is also one of the reasons. [0003] The electric power described in the former is still a necessary condition for making the electronic mac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/367H01L23/467
CPCH01L2924/3025H01L2224/48091H01L2224/48227H01L2924/19105H01L2924/1305H01L2924/13055
Inventor 坂本英行西塔秀史小池保広月泽正雄
Owner SANYO ELECTRIC CO LTD
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