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Heat exchanger and method for manufacturing it

A technology of heat exchangers and exchangers, which is applied in the fields of heat exchanger fixation, heat exchange equipment, semiconductor/solid-state device manufacturing, etc., and can solve problems such as loss of thermal performance and low thermal conductivity

Inactive Publication Date: 2009-04-08
FERRAZ SHAWMUT THERMAL MANAGEMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, the increase in thermal performance due to the fin material is mostly lost in the bonding, where the products used have very low thermal conductivity

Method used

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  • Heat exchanger and method for manufacturing it
  • Heat exchanger and method for manufacturing it
  • Heat exchanger and method for manufacturing it

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] Figure 1 to Figure 4 The heat exchanger 1 shown in includes a base 11 substantially in the shape of a rectangular block on which are mounted fins 12 which allow heat to be dissipated into the surrounding air by means of The two electronic components 2 and 2' are transferred onto the base 11 on the face 111 of 11 opposite to the face 112 from which the fins 12 extend.

[0025] The base 11 is formed by assembling together extruded aluminum elements 113 which are identical except for the end elements 113A and 113B. In a variant, the end elements can be identical to the other elements 113, in which case the small end face 116 and the end face 117 of the base 11 are ribbed.

[0026] Element 113, element 113A and element 113B of base 11 are distinct pieces that must be assembled together to form the base.

[0027] Each side of element 113 has a serrated profile formed by a series of channels 114 and ribs 115 extending parallel to end faces 116 and end faces 117 of base 11 ...

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PUM

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Abstract

In order to manufacture a heat exchanger comprising a metal base (11) and fins (12) with a part (125) made from recompressed expanded graphite, an edge (121) of at least one fin (12) is inset (Fi) by crushing a deformable portion (121) between two distinct parts (113, 113A, 113B) that make up the base (11). This deformable portion may be an edge (121) of the fin or a part attached in the region of this edge.

Description

technical field [0001] The invention relates to a method for producing a heat exchanger designed for cooling at least one power electronic component. The invention also relates to such a heat exchanger. Background technique [0002] Heat exchangers are commonly used to avoid unwanted overheating of power electronic components such as insulated gate bipolar transistor (IGBT) circuits or equivalent devices. As described in document FR-A-2 777 986, such a heat exchanger may comprise a plate on which are mounted tubes through which a cooling fluid circulates. As envisaged in US-A-2004 / 0000391, such a heat exchanger may also comprise a metal base on which graphite fins are mounted, engaging in channels machined into said base. Even with a friction fit, the mechanical fastening of these fins is not durable, in particular, the continued rise in temperature of the base makes its dimensional changes inconsistent with the changes of the fins. Consequently, the thermal contact of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28F21/02H01L23/373
CPCB23P2700/10H01L2924/0002H01L21/4882H01L23/3672F28F3/02B23P15/26H01L23/373F28F21/02F28F21/084F28F2255/16F28F2275/12F28F2275/14Y10T29/49345Y10T29/49393Y10T29/49908Y10T29/49936H01L2924/00
Inventor P·勒科克E·居永
Owner FERRAZ SHAWMUT THERMAL MANAGEMENT