Unlock instant, AI-driven research and patent intelligence for your innovation.

Multilayer circuit board having cable section, and manufacturing method thereof

A manufacturing method and technology of flexible circuit boards, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems of many constituent materials and high material cost

Inactive Publication Date: 2011-05-04
NIPPON MEKTRON LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when forming through-holes and blind via holes, when drilling holes for conduction, foreign matter such as drilling chips and dirt of each layer of material often occurs in the holes for conduction.
In addition, there is a problem of high material cost due to many constituent materials

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multilayer circuit board having cable section, and manufacturing method thereof
  • Multilayer circuit board having cable section, and manufacturing method thereof
  • Multilayer circuit board having cable section, and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] 1 is a cross-sectional view showing the structure of a multilayer flexible circuit board according to Embodiment 1 of the present invention. This is a circuit board 2 in which a circuit pattern including a cable portion is formed on a flexible insulating base material 1 as a base material. This circuit board 2 serves as an outer layer substrate.

[0065] Next, a cover layer 5 formed by laminating an adhesive material 4 on an insulating film 3 such as polyimide is bonded to either the upper or lower surface of the illustrated circuit board 2 . In this way, the two outer layer substrates 6 with cables constituted by the circuit board 2 and the cover layer 5 are prepared.

[0066] On the other hand, a double-sided inner layer substrate 9 having circuit patterns on both upper and lower surfaces of the illustrated substrate 7 is prepared. Then, the outer layer substrate 6 is attached to the upper and lower surfaces of the illustrated inner layer substrate 9 in a state of b...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed is a thin multilayer flexible circuit board having a cable portion drawn out from a plurality of outer layers. Also disclosed is a method for manufacturing such a thin multilayer flexible circuit board. Specifically disclosed is a multilayer flexible circuit board comprising a component-mounting portion having an inner layer substrate (107) and an outer layer substrate (106), and a cable portion drawn out from at least one of the inner layer substrate and the outer layer substrate. This multilayer flexible circuit board, wherein the inner layer substrate and the outer layer substrate respectively have a circuit opposite to each other, is characterized in that the circuits are covered by a cover 5 which is composed of one cover film and also serves as the cover for the cable portion.

Description

technical field [0001] The present invention relates to a multilayer circuit board having a flexible cable portion and a manufacturing method thereof, and more particularly to a structure of a build-up type multilayer circuit board having a flexible cable portion of a plurality of layers and a manufacturing method thereof. Background technique [0002] Fig. 5 is a sectional view showing the structure of main parts of a conventional multilayer circuit board having cable portions drawn out from a plurality of layers. On a flexible insulating base material 101 whose base material is polyimide or the like, a layer consisting of a cable portion of a flexible circuit board 102 having a circuit pattern including a cable portion on both sides is arranged, and the layer to be a cable portion is coated with polyimide. A cover layer 105 having an adhesive material 104 is bonded to an insulating film 103 such as an imide film to form a cable with an outer layer substrate 106 and an inne...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K1/118H05K3/002H05K3/281H05K3/386H05K3/4626H05K3/4691H05K2201/0195H05K2201/09509H05K2201/09518H05K2203/0554H05K3/46
Inventor 松田文彦
Owner NIPPON MEKTRON LTD