Surface treatment device and manufacture method of lower electrode assembly body of the device

Abstract

The present invention provides an apparatus for treating the surface of a substrate with plasma in atmospheric pressure and a method for manufacturing a lower electrode assembly thereof, wherein the apparatus for treating the surface is structured as disassembly of structure elements and easy assembly, maintenance such as replacement of electrodes can be easily carried out, and spacing between anupper electrode and a lower electrode is easily adjusted by adjusting thickness of an easily disassembled isolator, furthermore heat generated between the upper electrode and the lower electrode can be efficiently cooled with a cooling system for directly or indirectly cooling the upper electrode and the lower electrode, such that damage caused by heating can be prevented, thus electric arc phenomenon possibly generated on the upper electrode and the lower electrode is minimized.

Description

technical field [0001] The present invention relates to a surface treatment device using atmospheric pressure plasma, and more particularly to a surface treatment device using atmospheric pressure plasma that is configured as an assembled type that is easy to disassemble and assemble structural elements, is easy to perform maintenance such as electrode replacement, and is easy to disassemble and assemble by adjustment. The thickness of the separator makes it easy to adjust the interval between the upper electrode and the lower electrode, and through the cooling system that can directly or indirectly cool the above upper electrode and the lower electrode, the heat generated on the above upper electrode and the lower electrode can be effectively cooled, In this way, damage caused by thermalization is prevented, and arcing phenomenon that may occur on the upper electrode and the lower electrode is minimized; in addition, the present invention also relates to a method of manufactur...

AI Technical Summary

Problems solved by technology

[0010] First, for the above-mentioned upper electrode assembly 10, since the above-mentioned epoxy resin is filled inside the above-mentioned dielectric material 12 and cured at room temperature, many air bubbles are generated inside it, which may become the cause of the arc phenomenon, and because The high heat generated by the high voltage applied to the upper electrode assembly 10 for forming plasma cannot be released, smooth cooling cannot be performed, and damage such as cracks may occur on the dielectric.

[0011] Second, the spacer 30 interposed between the upper electrode assembly 10 and the lower electrode assembly 20 to keep them separated at a predetermined interval has the function of assembling the upper electrode assembly 10 and the lower electrode assembly 10 and the lower electrode assembly with epoxy resin. body 20 is adhesively connected, so when one of the above-mentioned upper electrode assembly 10 and lower electrode assembly 20 is to be replaced, especially the above-mentioned lower electrode assembly 20, since it cannot be partially replaced, there is a possibility that it must be replaced. Overall problems of the upper electrode assembly 10 and the lower electrode assembly 20

However, since the above-mentioned lower electrode assembly 20 and holder 40 have been subjected to insulation treatment in order to prevent erroneous discharge, it is necessary to remove a part of the insulation treatment to expose the metal part, and then Connect the above-mentioned contactor 50, and the exposed part should be insulated with epoxy resin, so there is a problem that its structure is complicated and difficult to assemble

In addition, as the use continues, the above-mentioned part insulated with epoxy resin will fall off, and the metal part will be exposed again, so there is a problem that an arc phenomenon will occur at this part when a high voltage is applied.

[0013] Fourth, when manufacturing the lower electrode assembly 20 having the above-mentioned structure, it is not only difficult to form each of hundreds of holes 29 such as through figure 2 The uniform taper described in (e) stage is cumbersome, and because the processed wall surface of the sprayed dielectric described in (f) stage is not uniform, thus during the plasma treatment, the dielectric attached to the wall surface falls off. The lower electrode 23 is exposed, and the arc phenomenon occurs

Moreover, there is also the problem that the above-mentioned detached dielectric and the fine fragments of the lower electrode 23 generated by the arc phenomenon fall on the substrate and contaminate the substrate.

Images