Surface treatment device and manufacture method of lower electrode assembly body of the device

A surface treatment device and assembly technology, which is applied in semiconductor/solid-state device manufacturing, circuits, discharge tubes, etc., can solve problems such as dropping, damage, and inability to release, and achieve the effects of preventing damage, easy manufacturing, and easy maintenance
CN101441986BInactive Publication Date: 2010-09-29LG ELECTRONICS INC

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
LG ELECTRONICS INC
Publication Date
2010-09-29
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention provides an apparatus for treating the surface of a substrate with plasma in atmospheric pressure and a method for manufacturing a lower electrode assembly thereof, wherein the apparatus for treating the surface is structured as disassembly of structure elements and easy assembly, maintenance such as replacement of electrodes can be easily carried out, and spacing between anupper electrode and a lower electrode is easily adjusted by adjusting thickness of an easily disassembled isolator, furthermore heat generated between the upper electrode and the lower electrode can be efficiently cooled with a cooling system for directly or indirectly cooling the upper electrode and the lower electrode, such that damage caused by heating can be prevented, thus electric arc phenomenon possibly generated on the upper electrode and the lower electrode is minimized.
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Description

technical field

[0001] The present invention relates to a surface treatment device using atmospheric pressure plasma, and more particularly to a surface treatment device using atmospheric pressure plasma that is configured as an assembled type that is easy to disassemble and assemble structural elements, is easy to perform maintenance such as electrode replacement, and is easy to disassemble and assemble by adjustment. The thickness of the separator makes it easy to adjust the interval between the upper electrode and the lower electrode, and through the cooling system that can directly or indirectly cool the above upper electrode and the lower electrode, the heat generated on the above upper electrode and the lower electrode can be effectively cooled, In this way, damage caused by thermalization is prevented, and arcing phenomenon that may occur on the upper electrode and the lower electrode is minimized; in addition, the present invention also relates to a method of manufactur...

Claims

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