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Radiator and fixed device for hot pipe

A technology of fixing device and heat dissipation device, which is applied in the direction of electrical solid devices, cooling/ventilation/heating transformation, semiconductor/solid device components, etc., which can solve the problem of affecting heat dissipation performance, increasing thermal resistance, and the inability of heat pipe 32 and die casting 31 full contact

Inactive Publication Date: 2009-06-24
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, the heat pipe 32 needs to penetrate into the receiving hole 312 and be fixed with the die-casting part 31 by heat-conducting glue, etc. The heat pipe 32 cannot be in uniform contact with the inner surface of the receiving hole 312, which leads to insufficient contact between the heat pipe 32 and the die casting 31, which increases the thermal resistance between the two and affects the heat dissipation performance

Method used

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  • Radiator and fixed device for hot pipe
  • Radiator and fixed device for hot pipe
  • Radiator and fixed device for hot pipe

Examples

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Embodiment Construction

[0016] The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

[0017] Figure 1 to Figure 3 Shown is a preferred embodiment of the heat pipe cooling device of the present invention. The heat pipe cooling device includes a radiator 40 disposed on the side of the circuit board 10 , a heat pipe 21 and a heat pipe fixing device 20 for fixing the heat pipe 21 on the circuit board 10 . The heat pipe 21 is a flat heat pipe, generally L-shaped, and includes an evaporation end 211 and a condensation end 212 . The condensing end 212 of the heat pipe 21 is fixedly connected to the radiator 40 , and transfers the heat absorbed by the evaporating end 211 to the radiator 40 . The evaporation end 211 of the heat pipe 21 performs heat exchange with the heating electronic component 11 on the circuit board 10 through the heat pipe fixing device 20 , and is fixed on the circuit board 10 through the heat pipe fixin...

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PUM

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Abstract

The invention relates to a device used for fixing a heat pipe, comprising a panel and an elastic piece. The panel comprises a contact plate which is used for carrying the heat pipe and two protruded posts which extend out along the same direction at the two sides of the contact plate, wherein, the heat pipe is arranged between the two protruded posts, and the free end of each protruded post is provided with at least one bump. The elastic piece comprises a press part, two connecting parts formed by extending from the two ends of the press part, and two locking parts formed by extending from the connecting parts, wherein, the press part is provided with two locking holes, the locking holes can detachably press and span the bump on the protruded post, so as to be sheathed on the lower part of the bump and cause the press part to press the heat pipe to the contact plate. In the device used for fixing the heat pipe in the invention, the elastic piece is clamped on the panel by the bump; the panel is formed by integral bending; the manufacturing process is simple, the producing speed is rapid; when in assembly, the elastic piece can be easily arranged on the panel only by the positive force generated by downward pressing of fingers, and the assembly program is simple.

Description

technical field [0001] The invention relates to a heat pipe cooling device and a heat pipe fixing device thereof. Background technique [0002] With the rapid development of the electronic industry, the high-speed, high-frequency and integration of electronic components make the calorific value increase dramatically. Therefore, heat dissipation has become a key issue for the industry. [0003] In the field of heat dissipation, heat dissipation modules are usually used to dissipate heat from electronic components, such as Figure 5 As shown, the heat dissipation module 30 includes a die-casting part 31, a heat pipe 32, a cooling fin set 33 and a shrapnel 34. The die-casting part 31 is in contact with a heating electronic component (not shown), and two Small cylinder 311 and a receiving hole 312 for receiving one end of the heat pipe 32, the other end of the heat pipe 32 is combined with the cooling fin group 33, and the elastic sheet 34 is provided with two locking holes 341 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/40
Inventor 洪锐彣梁政仁
Owner FU ZHUN PRECISION IND SHENZHEN
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