Radiator and fixed device for hot pipe

A technology of fixing device and heat dissipation device, which is applied in the direction of electrical solid devices, cooling/ventilation/heating transformation, semiconductor/solid device components, etc., which can solve the problem of affecting heat dissipation performance, increasing thermal resistance, and the inability of heat pipe 32 and die casting 31 full contact
CN101466233AInactive Publication Date: 2009-06-24FU ZHUN PRECISION IND SHENZHEN +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
FU ZHUN PRECISION IND SHENZHEN
Publication Date
2009-06-24
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a device used for fixing a heat pipe, comprising a panel and an elastic piece. The panel comprises a contact plate which is used for carrying the heat pipe and two protruded posts which extend out along the same direction at the two sides of the contact plate, wherein, the heat pipe is arranged between the two protruded posts, and the free end of each protruded post is provided with at least one bump. The elastic piece comprises a press part, two connecting parts formed by extending from the two ends of the press part, and two locking parts formed by extending from the connecting parts, wherein, the press part is provided with two locking holes, the locking holes can detachably press and span the bump on the protruded post, so as to be sheathed on the lower part of the bump and cause the press part to press the heat pipe to the contact plate. In the device used for fixing the heat pipe in the invention, the elastic piece is clamped on the panel by the bump; the panel is formed by integral bending; the manufacturing process is simple, the producing speed is rapid; when in assembly, the elastic piece can be easily arranged on the panel only by the positive force generated by downward pressing of fingers, and the assembly program is simple.
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Description

technical field

[0001] The invention relates to a heat pipe cooling device and a heat pipe fixing device thereof. Background technique

[0002] With the rapid development of the electronic industry, the high-speed, high-frequency and integration of electronic components make the calorific value increase dramatically. Therefore, heat dissipation has become a key issue for the industry.

[0003] In the field of heat dissipation, heat dissipation modules are usually used to dissipate heat from electronic components, such as Figure 5 As shown, the heat dissipation module 30 includes a die-casting part 31, a heat pipe 32, a cooling fin set 33 and a shrapnel 34. The die-casting part 31 is in contact with a heating electronic component (not shown), and two Small cylinder 311 and a receiving hole 312 for receiving one end of the heat pipe 32, the other end of the heat pipe 32 is combined with the cooling fin group 33, and the elastic sheet 34 is provided with two locking holes 341 ...

Claims

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