Radiator and fixed device for hot pipe
A technology of fixing device and heat dissipation device, which is applied in the direction of electrical solid devices, cooling/ventilation/heating transformation, semiconductor/solid device components, etc., which can solve the problem of affecting heat dissipation performance, increasing thermal resistance, and the inability of heat pipe 32 and die casting 31 full contact
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[0016] The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.
[0017] Figure 1 to Figure 3 Shown is a preferred embodiment of the heat pipe cooling device of the present invention. The heat pipe cooling device includes a radiator 40 disposed on the side of the circuit board 10 , a heat pipe 21 and a heat pipe fixing device 20 for fixing the heat pipe 21 on the circuit board 10 . The heat pipe 21 is a flat heat pipe, generally L-shaped, and includes an evaporation end 211 and a condensation end 212 . The condensing end 212 of the heat pipe 21 is fixedly connected to the radiator 40 , and transfers the heat absorbed by the evaporating end 211 to the radiator 40 . The evaporation end 211 of the heat pipe 21 performs heat exchange with the heating electronic component 11 on the circuit board 10 through the heat pipe fixing device 20 , and is fixed on the circuit board 10 through the heat pipe fixin...
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