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Convex column structure and electronic apparatus housing using the same

A technology of electronic devices and protrusions, which is applied in the direction of casing/cabinet/drawer parts, electrical components, magnetic field/electric field shielding, etc., and can solve the problem of destroying the integrity of the metal layer 112

Inactive Publication Date: 2009-07-01
COMPAL ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Please refer to Figure 2B , when the circuit board 120 is assembled to the boss 140 of the casing 110 via the bolt 130, Figure 2A The burrs 142 will be broken by the pressure of the circuit board 120, such as Figure 2B shown, thus destroying the integrity of the metal layer 112

Method used

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  • Convex column structure and electronic apparatus housing using the same
  • Convex column structure and electronic apparatus housing using the same
  • Convex column structure and electronic apparatus housing using the same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0048] Please refer to image 3 and Figure 4A , image 3 is a structural schematic diagram of an electronic device casing according to the first embodiment of the present invention, and Figure 4A for image 3 The partially enlarged schematic diagram of the convex column structure in . The electronic device case 200 includes a wall 210 , a protrusion 220 a and a metal layer 230 . The boss 220a is connected to the inner surface of the wall 210, and has a plane 222a at the top of the boss 220a and a chamfer 224 connecting the plane 222a, and the metal layer 230 covers the exposed part of the wall 210. The inner surface and the exposed surface of the protrusion 220a, and the protrusion 220a and the metal layer 230 covering the surface of the protrusion 220a form a protrusion structure 240a.

[0049] In the first embodiment, the chamfer 224 is, for example, a chamfer, and the material of the wall body 210 and the protrusion 220a is, for example, plastic, and the wall body 21...

no. 2 example

[0053] Please refer to Figure 4B , Figure 4B It is a partially enlarged schematic view of the protrusion structure in the second embodiment of the present invention. The protrusion structure 240b in the second embodiment is similar to the protrusion structure 240a in the first embodiment. The difference between the two is that the protrusion 220b of the protrusion structure 240b further has a shoulder 222c, and the shoulder 222c is away from the plane 222a and connected to the plane 222a via the chamfer 224 . At this time, the burr 226 formed on the boss 220b after the mold is removed is located between the shoulder 222c and the outer surface 222b of the boss 220b, so that the height of the burr 226 will be lower than the top plane 222a of the boss 220b.

no. 3 example

[0055] Please refer to Figure 4C , Figure 4C It is a partially enlarged schematic view of the protrusion structure in the third embodiment of the present invention. The protrusion structure 240c in the third embodiment is similar to the protrusion structure 240a in the first embodiment. The difference between the two lies in that the chamfer 224 of the protrusion 220 a in the first embodiment is a chamfer, while the chamfer 224 of the protrusion 220 c in the third embodiment is a rounded corner.

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PUM

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Abstract

A column structure comprises a column and a metal layer, wherein, the column is provided with a plane positioned at the top end of the column and a chamfer connected with the plane; the exposed surface of the column is completely coated with the metal layer. The column is provided with the chamfer, so that when the column is provided with raw edges, the raw edges can be lower than the plane at the top end of the column and can be not damaged when other components are locked on the column structure. Therefore, the integrity of the metal layer of the column structure is kept.

Description

technical field [0001] The present invention relates to a boss structure (boss structure), and in particular to a boss structure disposed on the inner wall of an electronic device and having the ability to prevent Electro-Magnetic Interference (EMI) and Electro-Static Discharge (Electro-Static Discharge). Discharge, ESD) the convex column structure of the outer metal layer. Background technique [0002] In order to avoid the problems of electromagnetic interference and electrostatic discharge, the inner surface of the plastic casing of the electronic device is usually covered with a layer of metal layer, which is electrically connected to the ground of the electronic device. For example, after the plastic casing is made by injection molding, a metal layer is coated on the inner surface of the plastic casing by sputtering or evaporation, and the The metal layer is electrically connected to the ground of the circuit board of the electronic device. [0003] figure 1 It is a ...

Claims

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Application Information

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IPC IPC(8): H05K5/02H05K9/00
Inventor 许游童赖钟国
Owner COMPAL ELECTRONICS INC
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