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Heat pipe structure

A heat pipe and pipe body technology, applied in the field of heat transfer structure, can solve the problems of overheating and difficulty in dissipation of heat-generating components of electronic devices, and achieve good heat transfer efficiency

Inactive Publication Date: 2010-10-13
COMPAL ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the electronic device is miniaturized, the derived problem is that the heat generated by the heat-generating components of the electronic device is becoming more and more concentrated, and it is more and more difficult to dissipate to the environment, which will easily cause the heat-generating components of the electronic device to overheat

Method used

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Embodiment Construction

[0052] The invention relates to a heat pipe structure applied to an electronic device. Figure 1A It is a schematic diagram of utilizing a heat pipe structure according to an embodiment of the present invention to transfer heat from a heat generating component to a radiator, Figure 1B for Figure 1A Cross-sectional view of the heat pipe structure along the line II-II. Please refer to Figure 1A and Figure 1B , the heat pipe structure 200 of this embodiment includes a pipe body 210 and a working medium 220 . The tube body 210 has two opposite closed ends 212 a and 212 b and an inner wall 214 . In this embodiment, the tube body 210 is, for example, an oblate tube body, and the tube body 210 can use its planar outer surface 216 to be in close contact with a heating component 50, wherein the heating component 50 is, for example, an electronic component or Other components that generate heat during operation. A cavity V is formed by the inner wall surface 214 , the closed end ...

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PUM

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Abstract

The invention provides a thermotube structure, comprising a tube body and a working substance. The tube body is provided with two opposite closed terminations, an internal face, a compression part and an expanding part. The internal face forms an empty cavity with two opposite enclosed terminations; the compression part comprises a plurality of first grooves and the first grooves are arranged at the internal face; each of the first grooves comprises a first width; the expanding part comprises a plurality of second grooves and the second grooves are arranged at the internal face; each of the second grooves comprises a second width which is approximately equal to the first width; and the working substance is arranged in the empty cavity.

Description

technical field [0001] The present invention relates to a heat transfer structure, and more particularly to a heat pipe structure applied to an electronic device. Background technique [0002] With the development of electronic circuits toward high integration and small size, many types of electronic devices are becoming lighter, thinner, shorter and smaller. However, when the electronic device is miniaturized, the derived problem is that the heat generated by the heat-generating components of the electronic device is becoming more and more concentrated, and it is more and more difficult to dissipate into the environment, which easily leads to the overheating of the heat-generating components of the electronic device. In order to solve the problem that the heat-generating components of the electronic device cannot work normally due to overheating, heat dissipation technology is particularly important. Heat pipes are commonly used heat transfer components in heat dissipation...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/427F28D15/02H05K7/20
Inventor 萧伟宗王炫证田奇伟
Owner COMPAL ELECTRONICS INC