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Method of manufacturing structured release liner

A release liner, structured technology for chemical instruments and methods, film/sheet adhesives, pressure sensitive films/sheets, etc., to solve problems such as material loss of use

Inactive Publication Date: 2012-11-14
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Adhesion loss at either interface can render the material useless

Method used

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  • Method of manufacturing structured release liner
  • Method of manufacturing structured release liner
  • Method of manufacturing structured release liner

Examples

Experimental program
Comparison scheme
Effect test

example 1 and 2 and comparative example C1

[0059]Contour extruded films of PP (Comparative Example C1 ) and PP and additives (Examples 1 and 2) with a width of 19 cm (7.5 inches) were prepared using the following equipment: 6.4 cm (2.5 inches) with a 20 cm (8 inches) die Davis-Standard Single Screw Extruder (Davis-Standard SingleScrew Extruder), the die has wire cut parallel semi-circular grooves, the depth of the semi-circular grooves is 25 microns (1 mil), the pitch is 152 microns (6 mils), and its The distribution density is 66 columns / cm (167 columns / inch). The extruder temperature was: 177°C (350°F) in zone 1; 204°C (400°F) in zone 2; 232°C (450°F) in zone 3; 232°C (450°F) in zone 4 and a block temperature of 232 °C (450°F); screw speed 5 RPM, extrusion rate 3 m / min (10 ft / min), thickness 114 microns (4.5 mils). There is a cooling water bath at 16°C (60°F) within 1.3 cm (0.5 inches) of the module. The amounts of additives used are shown in Table 1. The surface energy and wettability of the planar surfaces of ea...

example 3

[0064] Film samples prepared in Example 2 were coated with a thin layer of silicone release solution using a Number 5 Mayer rod, dried in an oven at 104°C for 2 minutes, and then post-cured at room temperature for one day . The mold release solution was a mixture containing: 18.2 grams of heptane, 4.6 grams of MEK, 4.0 grams of SYL-OFF 292 silicone polymer (commercially available from Dow Corning, Midland, MI), 0.11 grams of SYL-OFF 297 Fixing additive (commercially available from Dow Corning, Midland, MI), 0.11 grams of SYL-OFF C4-2117 fast curing additive (commercially available from Dow Corning, Midland, MI), and 0.17 grams of SYL-OFF 176 tin catalyst ( Commercially available from Dow Corning, Midland, MI). The release coating film was coated with the PSA solution at a nominal wet thickness of 178 microns (7 mils) and dried in an oven at 71°C for 10 minutes.

[0065] A film backing of PVC was laminated to this dried adhesive. The film backing / PSA samples were smoothly an...

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Abstract

Disclosed herein is a method of manufacturing a structured release liner. The method includes providing an extrudable material; extruding the extrudable material through a die having a profile thereby forming a base and at least one rail. The rail has a height over the base of less than 100 micrometers. In other embodiments, a first and second extrudable material are provided and are extruded through the die to create a first layer and a second layer. The structured release liner may also be formed by extruding onto an existing substrate. Also disclosed herein is a method of forming a laminate construction comprising an adhesive layer and a backing.

Description

technical field [0001] This patent application relates to a method of making a structured release liner, in particular to an extrusion process using a contoured die to form a structured release liner. Background technique [0002] Pressure sensitive adhesives can be used to join the two materials. The interface between the adhesive and the two materials is extremely important to the properties of the materials being joined. Adhesion loss at either interface can render the material useless. Adhesives have been structured in the past for a variety of reasons. [0003] Various methods for structuring adhesives are known, including, for example, U.S. Patent Application Nos. 5,296,277 and 5,362,516 (both to Wilson et al); 5,141,790 and 5,897,930 (both to Calhoun et al); and 6,197,397 Methods disclosed in (Sher et al.). These patents disclose how to build structures in the adhesive from the interface between the adhesive and the release liner. [0004] These release liners ar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C47/06B29C47/04B29C48/08B29C48/19B29C48/20B29C48/21B29C48/30
CPCB29C47/06B29C47/0064C09J7/0232C09J7/0207B29C47/025B29C47/064B29C47/065B29C47/003B32B7/06C09J2201/28B29C47/145B29C47/0021B29C47/128B32B27/32B32B3/30C09J7/38C09J7/403B29C48/08B29C48/19B29C48/20B29C48/21C09J2301/204B29C48/18B29C48/16
Inventor 弗兰克·T·谢尔戴维·J·亚鲁索布赖恩·E·斯贝瓦克
Owner 3M INNOVATIVE PROPERTIES CO