Method for manufacturing high frequency copper-clad plate

A manufacturing method and copper-clad laminate technology, applied in printed circuit manufacturing, chemical instruments and methods, improvement of metal adhesion of insulating substrates, etc., can solve problems such as low dielectric constant, small dielectric loss, and inability to adapt to the rapid development of information industry , to achieve the effect of clear message transmission and low dielectric loss

Inactive Publication Date: 2009-09-16
黄威豪
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to achieve high-speed high-frequency signal transmission, the board is required to have a lower dielectric constant and a smaller dielectric loss. However, the dielectric constant of traditional high-frequency copper-clad laminates is generally around 2.65, which cannot meet the needs of the rapid development of the information industry.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] A manufacturing method of a high-frequency copper-clad laminate disclosed in the present invention is a plate made of high-frequency material polytetrafluoroethylene PTFE as a base material, and copper foil is coated on both sides by PFA; the specific manufacturing method includes the following steps:

[0013] 1) Cutting: Cut the polytetrafluoroethylene sheet PTFE, PFA and copper foil to the appropriate size;

[0014] 2) Pretreatment: immerse the polytetrafluoroethylene base material in the sodium naphthalene treatment solution to perform sodium naphthalene treatment in an oxygen-free environment. The sodium naphthalene treatment solution can adopt the following proportions: naphthalene 10% to 20%; sodium 10 to 20%; Tetrahydrofuran 60% to 80%, prepared by dissolving naphthalene and metal sodium in tetrahydrofuran, then washing and drying with acetone, and storing in a dust-free environment for later use;

[0015] 3) Lamination hot pressing: put the copper foil, PFA, PTF...

Embodiment 2

[0019] A manufacturing method of a high-frequency copper-clad laminate disclosed in the present invention is a plate made of high-frequency material polytetrafluoroethylene PTFE as a base material, and copper foil is coated on both sides by PFA; the specific manufacturing method includes the following steps:

[0020] 1) Cutting: Cut the polytetrafluoroethylene sheet PTFE, PFA and copper foil to the appropriate size;

[0021] 2) Pretreatment: The polytetrafluoroethylene base material is impregnated with sodium naphthalene treatment solution and treated with sodium naphthalene in an oxygen-free environment. The sodium naphthalene treatment solution can adopt the following ratio: 10% to 20% of naphthalene; 10% to 20% of sodium %; tetrahydrofuran 60% to 80%, prepared by dissolving naphthalene and metal sodium in tetrahydrofuran, then washing and drying with acetone, and storing it in a dust-free environment for later use;

[0022] 3) Lamination hot pressing: put copper foil, PFA, ...

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PUM

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Abstract

The invention discloses a method for manufacturing a high frequency copper-clad plate. The high frequency copper-clad plate is manufactured by taking a high frequency material, namely polytetrafluorothylene (PTFE) as a base material and cladding a copper clad on two surfaces of the PTFE through PFA. The manufacturing method comprises the steps of cutting, pretreatment, laminating hot pressing, edge cutting and the like. The method adopts the PTFE with low dielectric constant as a medium for filling the high frequency material, and the manufactured high frequency copper-clad plate has lower dielectric constant and less dielectric loss; and by testing, the dielectric constant can reach 2.0 to 2.2, the dielectric loss is lower, and the high frequency copper-clad plate makes the information transmit more clearly and really during information transmission, and can meet the requirement of 3G information development.

Description

technical field [0001] The invention relates to a manufacturing method of a high-frequency copper-clad laminate. Background technique [0002] High-frequency copper-clad laminates are widely used in aerospace, satellite communications, navigation and other fields. In recent years, with the rapid development of the information industry, especially entering the 3G information age, the demand for high-frequency copper-clad laminates is gradually increasing. In order to achieve high-speed high-frequency signal transmission, the board is required to have a lower dielectric constant and a smaller dielectric loss. However, the dielectric constant of traditional high-frequency copper-clad laminates is generally around 2.65, which cannot meet the needs of the rapid development of the information industry. . Contents of the invention [0003] In order to overcome the deficiencies of the prior art, the present invention provides a method for manufacturing a high-frequency copper-cla...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/38B32B37/10B32B37/06B32B38/04
Inventor 黄威豪
Owner 黄威豪
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