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Wet processing using a fluid meniscus, apparatus and method

一种弯液面、流体的技术，应用在使用液体的清洁方法、化学仪器和方法、清洁方法和用具等方向

Inactive Publication Date: 2009-09-23
MATERIALS & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] One of the major drawbacks of all existing technologies is that wet processing relies on immersion of the part in a liquid, some form of jetting, or a combination of liquid delivery and substrate rotation to achieve surface exposure to the liquid

Method used

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  • Wet processing using a fluid meniscus, apparatus and method
  • Wet processing using a fluid meniscus, apparatus and method
  • Wet processing using a fluid meniscus, apparatus and method

Examples

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Embodiment Construction

[0074] Although a large number of possible uses can be envisioned, in its preferred embodiment the invention provides a significant improvement over the prior art for wet processing of one side of a substrate without detrimentally disturbing the back side thereof. It is anticipated that true single-sided wet processing, such as that provided by the inventive subject matter, will enable further and faster increases in the functionality of each die and the density of parts or devices by relieving the constraints on using both sides of the substrate. Additionally, the ability to etch or thin substrates may be provided in a more environmentally safe, faster, uniform and economical manner.

[0075] An example of one such application using the present invention is the integration of CMOS and MEMS devices, each type on its own side of the substrate and through its own processing line. This is particularly meaningful because this example shows that two types of devices would benefit f...

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Abstract

A wet processing apparatus and method that takes advantage of a fluid meniscus to process at least a portion of a surface of an object. After one surface of the object has been processed another side or surface of the object can be similarly processed. This processing can be coating, etching, plating, to name a few. An application of the apparatus and method is in the semiconductor processing industry, especially, the processing of wafers and substrates. The method and apparatus also allows the processing of multiple surfaces of an electronic component.

Description

[0001] related application [0002] This application claims priority to Applicant's co-pending U.S. nonprovisional patent application, designated "11828 / 2," filed on October 16, 2006, which is a continuation-in-part, filed on the same date as it, and claims the benefit of Priority to U.S. Patent Application No. 09 / 675,029, filed September 28, 2000, which itself is based on U.S. Provisional Patent Application No. 60 / 156,582, filed September 29, 1999 The disclosures of each of these applications are hereby incorporated by reference in their entirety and claiming the benefit of priority thereto. technical field [0003] The present invention relates to an improved method and apparatus for exposing a surface to a liquid using at least one fluid meniscus. Such a system is suitable for "wet processing" a single side of a substrate without disturbing the "back side", while in some embodiments, the confinement of fluid to the front side is aided by, for example, air flow, as in vari...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D1/28B05D5/12B08B3/00B08B3/10G03D3/02H01L21/677B05C13/02
CPCH01L21/6715C23C18/161H01L21/67057C25D5/02H01L21/67086Y10S134/902
Inventor R·I·弗恩特斯
Owner MATERIALS & TECH
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