Apparatus for transferring packaged chips, test handler and method for manufacturing packaged chips

A technology for installing chips and equipment, applied in the field of testing processors

Active Publication Date: 2009-09-30
MIRAE CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the picker 104 cannot move while maintaining a precise gap, thereby deteriorating the func...

Method used

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  • Apparatus for transferring packaged chips, test handler and method for manufacturing packaged chips
  • Apparatus for transferring packaged chips, test handler and method for manufacturing packaged chips
  • Apparatus for transferring packaged chips, test handler and method for manufacturing packaged chips

Examples

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Embodiment Construction

[0044] An exemplary embodiment of an apparatus for transferring packaged chips according to the present invention will be described below with reference to the accompanying drawings.

[0045] image 3 is a perspective view illustrating an apparatus for transferring packaged chips according to an embodiment of the present invention. Figure 4 is along the diagram image 3 An exploded perspective view of the apparatus for transferring packaged chips according to this embodiment of the present invention, seen in the direction of the middle arrow H. Figure 5 is along the diagram image 3 An exploded perspective view of the apparatus for transferring packaged chips according to this embodiment of the present invention, seen in the direction of the middle arrow I. Figure 6 is a perspective view illustrating a second picker of the apparatus for transferring packaged chips according to the embodiment of the present invention. Figure 7 is a perspective view illustrating a state ...

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PUM

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Abstract

The present invention provides an apparatus for transferring packaged chips, a test handler, and a method for manufacturing packaged chips. The apparatus for transferring packaged chips includes: a main frame having a coupling member coupled to a base plate and a supporting member coupled to the coupling member, a plurality of first pickers coupled to one side of the supporting member so as to be movable in a horizontal direction, a plurality of second pickers coupled to the other side of the supporting member so as to be movable in the horizontal direction, and a control unit to determine distances by which the first pickers and the second pickers move in the horizontal direction. According to the structure, more packaged chips may be transferred each time, and the time for loading and unloading is reduced. The gap between the packaged chips can be accurately controlled, and thereby improving the loading and unloading precision.

Description

technical field [0001] The invention relates to a test handler for connecting packaged chips to be tested to a testing machine and classifying the tested packaged chips according to levels according to test results. Background technique [0002] A test handler (also referred to as a "test sorter", "test handler", etc.) may be used to perform electrical tests on the packaged chips at the end of the packaging process. [0003] The test handler is connected to a specific tester for testing the packaged chips. The testing machine includes a hi-fix board having a plurality of test sockets arranged therein, wherein packaged chips are connected to the test sockets. A hyperlocation board is bonded to the test handler. [0004] The test handler performs a loading process, an unloading process, and a testing process using a test tray including a plurality of receiving units capable of receiving packaged chips. [0005] Packaged chips to be tested are transferred from customer trays...

Claims

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Application Information

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IPC IPC(8): G01R31/28H01L21/677H01L21/66H01L21/00B07C5/344
CPCH01L21/67271H01L21/67742H01L21/6838G01R31/2893B65G47/26B65G47/90B65G49/07
Inventor 赵在敬朴海俊
Owner MIRAE CORPORATION
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