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Encapsulation structure of light emitting diode

A technology of light-emitting diodes and packaging structures, applied to electrical components, circuits, semiconductor devices, etc., which can solve the problems of inability to change, inconvenience and cost increase, lens holder 13, optical lens 12 movement or rotation, etc., to achieve rapid replacement of light types , easy disassembly, shortening the time

Inactive Publication Date: 2011-05-11
E PIN OPTICAL IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the light-emitting diodes that can generate special light patterns have very strict requirements on the positioning of the optical lenses in the package structure, because as long as there is a slight change in the position of the optical lenses, or a slight rotation of the optical lenses, the light emission will be affected. Diode light quality
However, the packaging structure 1 of the above-mentioned known technology only fixes the lens holder 13 and the optical lens 12 on the base 10 in such a way that the support column 131 of the lens holder 13 is limited in the through hole 101, but after a long period of use , the packaging structure will inevitably be shaken or vibrated by external forces, so that the support column exposed through hole part 19 cannot effectively limit the support column 131 in the through hole 101, so that the lens fixing seat 13 may become loose and cause the optical lens 12 to move or rotate. , which in turn affects the light-emitting light pattern of the light-emitting diode
[0005] In particular, if the light-emitting diode manufactured by using glue or support column 131 is thermally melted and deformed, if it is installed on a lamp or other illuminant, its light pattern cannot be changed because the optical lens is fixed on the light-emitting diode; When the light type needs to be replaced, the entire group of LEDs must be replaced, which causes inconvenience and increases the cost

Method used

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  • Encapsulation structure of light emitting diode
  • Encapsulation structure of light emitting diode
  • Encapsulation structure of light emitting diode

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Embodiment Construction

[0024] In order to make the present invention clearer and more detailed, preferred embodiments are listed here and combined with the following diagrams, and the structure and technical features of the present invention are described in detail as follows. The following disclosed embodiments of the present invention are descriptions for the main components of the packaging structure of the light emitting diode of the present invention. Therefore, although the following disclosed embodiments of the present invention are applied to a light emitting diode, they generally have a package of light emitting diodes In terms of structure, except for the packaging structure disclosed in the present invention, other structures belong to common technical means, so those skilled in the art should understand that the components of the packaging structure of light emitting diodes disclosed in the present invention are not limited to the following The disclosed embodiment structure. That is to ...

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Abstract

The invention discloses an encapsulation structure of a light emitting diode, which comprises a base, a light emitting diode chip, an optical lens and a lens fixing seat, wherein the surface of the base is provided with a fixing seat positioning hole, and the side edge is provided with a containing groove. The lens fixing seat is provided with an open hole, a fixing seat positioning pole and a clamping hook structure,; the optical lens is arranged between the lens fixing seat and the base and passes through the open hole; the lens fixing seat clamps the containing groove by the clamping hook structure and is fixed on the base; and the lens fixing seat is embedded into the fixing seat positioning hole by the fixing seat positioning pole and positioned on the base to strengthen the positioning of the optical lens and the base so as to enable the optical lens to generate a scheduled light type. In addition, the invention can also shorten the time required by the encapsulation process, andcan replace the optical lens by simply disassembling the lens fixing seat so as to achieve the purpose of rapid replacement of the light type.

Description

technical field [0001] The invention relates to a packaging structure of a light emitting diode, in particular to a packaging structure in which an optical lens is fixed on a base by using a lens fixing seat in an engaging manner and the optical lens can be quickly replaced. Background technique [0002] Light-emitting diodes (LEDs) use the principle of direct conversion of electrical energy into light energy. A voltage is applied to the positive and negative terminals in the semiconductor. When the current passes, electrons and holes are combined to release energy. The energy is in the form of light. Release, this is the light-emitting principle of light-emitting diodes. Light-emitting diodes use different materials, and the energy levels of the materials make the photon energy produce light of different wavelengths. Light-emitting diodes have the advantages of small size, fast response and no pollution. These advantages make the application of light-emitting diodes gradua...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00
Inventor 林宇峰廖怡芬
Owner E PIN OPTICAL IND