Package structure for LED

A technology of light-emitting diodes and packaging structures, applied in the direction of electrical components, electrical solid devices, circuits, etc., to achieve the effects of increasing life cycle, easy implementation, and less heat attenuation
CN101577304AActive Publication Date: 2009-11-11EPISTAR CORP
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
EPISTAR CORP
Publication Date
2009-11-11

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Abstract

The invention relates to a package structure for LED and manufacturing method thereof. In a preferred embodiment of the package structure for LED, a plurality of thermal vias are located through the packaging substrate to effectively transfer heat away from the LED, and are preferably formed along with conductive vias that extend through the packaging substrate. The thermal vias are preferably in the shape of circles or rectangular, and may either be solid or else may encircle and enclose a portion of the packaging substrate. Advantage of the preferred embodiment is that heat generated by the LED can be radiated rapidly and effectively by the package structure, less thermal decay is generated, and thereby life circle of the LED in increased.
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Description

technical field

[0001] The present invention relates to a structure and a manufacturing method of a light emitting diode (LED), and in particular to a structure and a manufacturing method of a packaged LED. Background technique

[0002] The demand for LEDs has been increasing over the past few years, especially high brightness and high power LEDs. However, although high-brightness and high-power LEDs can generate a large amount of light, they also generate a large amount of heat, which will cause performance degradation of the LED and shorten the life cycle of the LED. Therefore, heat must be dissipated from the LED as quickly and efficiently as possible.

[0003] Recently, in the technical field of LED packaging, a packaging structure using a silicon substrate has been developed. Silicon substrates generally have excellent processability and relatively good thermal conductivity. These silicon substrate packaging structures conduct heat through the silicon substrate itsel...

Claims

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