Method for pressing layer gasket of rigid-flexible product

Abstract

The invention relates to a method for pressing a layer gasket of a rigid-flexible product, which comprises the following: step 1, providing a combination of a rigid plate and a flexible plate, wherein the rigid plate is provided with an internal groove; step 2, providing a prepreg gasket; step 3, preliminarily processing and pre-curing the prepreg gasket; step 4, processing the appearance of the pressed and pre-cured gasket; step 5, filling the gasket into the internal groove of the rigid plate; and step 6, pressing the combination of the rigid plate filled with the gasket and the flexible plate. The method for pressing the layer gasket of the rigid-flexible product can protect a flexible part of the product from being wrinkled and bent at high pressure and high temperature of a pressure plate, protect the flexible plate from the corrosion of liquid medicine during wet flows, simultaneously keep the plate surface flat, and reduce the processing difficulty of processes such as drilling, D / F and the like.

Description

technical field [0001] The invention relates to a gasket pressing method, in particular to a gasket pressing method using a rigid-flexible product layer. Background technique [0002] Now the rigid-flex circuit board manufacturing industry generally uses the gasket process for processing and manufacturing, but there are many shortcomings and deficiencies in the production and use of the gasket itself. The common gasket is made of FR4 material, and its processing and use process There are mainly the following problems, such as the poor fit between the gasket and the rigid plate, that is, the size of the gasket is too small, the size is too large, or there are too many corners, the area ratio of the gasket to the plate is too large, or the corners, radians and rigidity of the gasket are too large. Poor board fit, prone to problems such as crushing, wrinkling, and easy drop of the flexible board; in addition, in the wet process such as electroplating, the problem of inner layer...

AI Technical Summary

Problems solved by technology

[0002] Now the rigid-flex circuit board manufacturing industry generally uses the gasket process for processing and manufacturing, but there are many shortcomings and deficiencies in the production and use of the gasket itself. The common gasket is made of FR4 material, and its processing and use process There are mainly the following problems, such as the poor fit between the gasket and the rigid plate, that is, the size of the gasket is too small, the size is too large, or there are too many corners, the area ratio of the gasket to the plate is too large, or the corners, radians and rigidity of the gasket are too large. Poor board fit, prone to problems such as crushing, wrinkling, and easy drop of the flexible board; in addition, in the wet process such as electroplating, the problem of inner layer seepage of liquid medicine occurs; Unevenness, leading to problems such as photochemical image transfer (D / F) and other processes that cannot be processed

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