Method and apparatus for applying liquid material, and program

A technology of liquid materials and filling methods, which can be applied to devices for coating liquid on the surface, electric solid devices, semiconductor devices, etc., and can solve problems such as reduced discharge volume and insufficient capillary tubes

Active Publication Date: 2009-12-16
MUSASHI ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because when the viscosity becomes high, the discharge amount of the material discharge port decreases, and the capillary phenomenon is insufficient, and there is a problem that an appropriate amount of material cannot be filled in the gap.

Method used

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  • Method and apparatus for applying liquid material, and program
  • Method and apparatus for applying liquid material, and program
  • Method and apparatus for applying liquid material, and program

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0084] The best mode for implementing the present invention will be described below.

[0085] (1) Formation of overall coating pattern

[0086] Make one or more overall coating patterns, choose one of them. The overall coating pattern is composed of multiple correction coating patterns, or a combination of more than one non-correction coating pattern and one or more correction coating patterns, and at least one correction coating pattern must be present. For example, if Image 6 As shown, a corrected coating pattern 14 composed of alternately continuous coated areas 12 and non-coated areas 13 is made along a line along one side of a square workpiece, that is, a chip 2, and the entire length of the corrected coated pattern 14 is formed. The overall coating pattern is composed of the same non-correction coating pattern 15 consisting only of the coating area 12 along one side of the same chip 2 . Furthermore, the workpiece is not limited to a square shape, and may be circular ...

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PUM

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Abstract

The invention provides a method and an apparatus for applying a liquid material, which do not require complicated parameter calculation and flexibly correspond to discharge quantity change, and to provide a program. In a liquid material applying method, an entire application pattern composed of a non-correcting application pattern along the outer circumference of a work and a correcting application pattern overlapping the non-correcting application pattern is formed, and based on the entire application pattern, the liquid material is discharged from a discharge section. Then, the liquid material is applied into a gap between a substrate and the work placed on the substrate by using capillary phenomenon. The correcting application pattern is composed of an application area and a non application area, and a liquid material discharge quantity is corrected by increasing and reducing the application area and the non application area of the correcting application pattern.

Description

technical field [0001] The present invention relates to a filling method, device, and program for filling a gap between a substrate and a work placed thereon with a liquid material discharged from a discharge portion by capillary action, especially in the underfill step of a semiconductor package A method, device and program for correcting the discharge volume of a liquid material without performing complex parameter calculations. [0002] Furthermore, "discharging" in the present invention includes a discharge method in which the liquid material contacts the workpiece before leaving the discharge part, and a discharge method in which the liquid material contacts the workpiece after leaving the discharge part. Background technique [0003] In recent years, with the miniaturization and high performance of electronic equipment, high-density mounting and multi-pin semiconductor parts are required, and a mounting technology called flip chip method has been paid attention to. Fl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56B05C5/00B05C11/10B05D1/28
CPCH01L24/743H01L2924/01019H01L2224/73203H01L24/27H01L21/563H01L2924/01004H01L2224/73204H01L2224/16225H01L2224/32225H01L2924/00011H01L2924/00014H01L2924/00H01L2224/0401B05C5/00B05C11/10B05D1/28H01L21/56
Inventor 生岛和正
Owner MUSASHI ENG INC
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