Resin molding apparatus

Abstract

Disclosed is a resin molding apparatus capable of enhancing transfer accuracy, reducing the cost of a molding apparatus, and shortening a molding cycle. The resin molding apparatus includes a first mold; a second mold disposed in opposition to the first mold; a transfer plate (34) attached to one of the first and second molds and comprising a transfer surface bearing a pattern of pits and projections and oriented toward a cavity (C1, C2); and a thermal insulation layer (40) disposed between the transfer plate (34) and the one of the first and second molds and formed through growth from the transfer plate (34) side or from the one of the first and second mold sides. Being disposed between the transfer plate (34) and the one of the first and second molds, the thermal insulation layer (40) can restrain dissipation of thermal energy of a molding material toward the mold. This can restrain formation of a skin layer, which would otherwise result from a sharp drop in temperature of the molding material, whereby transfer accuracy can be enhanced.

Description

[0001] This application is a divisional application of a Chinese patent application with an application date of April 20, 2007, an application number of 200780014069.8, and an invention title of "Resin Molding Device and Resin Molding Method". technical field [0002] The present invention relates to a resin molding device. Background technique [0003] Conventionally, in a molding machine such as an injection molding machine, resin heated and melted in a heating cylinder is filled into a cavity space in a mold device, cooled and solidified in the cavity space, and a molded product is formed. [0004] The above-mentioned injection molding machine has a metal mold device as a resin molding device, a mold clamping device, and an injection device. The injection device includes a heating cylinder for heating and melting the resin, and is mounted on the front end of the heating cylinder for injecting the molten resin. The injection nozzle of the injection molding machine, the scr...

AI Technical Summary

Problems solved by technology

However, if the temperature of the mold device 11 is raised, the time required for cooling the resin becomes longer accordingly, and the molding cycle becomes longer.

In addition, it is conceivable to arrange a temperature adjustment mechanism in the mold device 11 to adjust the temperature of the mold device 11, but in this case, not only the cost of the mold device 11 becomes high, but also the A large amount of energy is consumed, and the cost of the light guide plate becomes higher

[0017] Furthermore, in order to improve the transfer accuracy, there is a method of increasing the pressure in the cavity spaces C1 and C2 to mechanically crush and plastically deform the skin layer. The pattern of the printing plate 34 deteriorates, and the durability of the transfer plate 34 becomes low

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